Related papers: 3D-Integrated Superconducting qubits: CMOS-Compati…
The realisation of an universal quantum computer will require the operation of thousands to millions of qubits. The possibility of using existing industrial semiconductor fabrication techniques and infrastructure for up-scaling and…
Superconducting circuits are highly controllable platforms to manipulate quantum states, which make them particularly promising for quantum information processing. We here show how the existence of a distance-independent interaction between…
A switch capable of routing microwave signals at cryogenic temperatures is a desirable component for state-of-the-art experiments in many fields of applied physics, including but not limited to quantum information processing, communication…
Cryogenic microwave measurement of superconducting quantum devices is complicated by the packaging required to connect devices to control and readout circuitry. In this work, we outline the design and experimental demonstration of a…
Increasing the density of superconducting circuits requires compact components, however, superconductor-based capacitors typically perform worse as dimensions are reduced due to loss at surfaces and interfaces. Here, parallel plate…
Due to their unique properties as lossless, nonlinear circuit elements, Josephson junctions lie at the heart of superconducting quantum information processing. Previously, we demonstrated a two-layer, submicrometer-scale overlap junction…
Extensible quantum computing architectures require a large array of quantum devices operating with low error rates. A quantum processor based on superconducting quantum bits can be scaled up by stacking microchips that each perform…
Integrating 2D materials into circuit quantum electrodynamics (c-QED) devices is an emerging filed in recent years. This integration not only facilitates the exploration of potential applications in quantum information processing but also…
Increasing circuit complexity within quantum systems based on superconducting qubits necessitates high connectivity while retaining qubit coherence. Classical micro-electronic systems have addressed interconnect density challenges by using…
Fast and high-fidelity qubit readout requires strong coupling between the readout resonator and the feedline. However, such coupling unavoidably enhances qubit decay through the Purcell effect. We present a four-pole broadband Purcell…
Bump bonding is a superior assembly alternative compared to conventional wire bond techniques. It offers a highly reliable connection with greatly reduced parasitic properties. The Flip Chip on Board (FCOB) procedure is an especially…
We introduce a hybrid qubit based on a semiconductor nanowire with an epitaxially grown superconductor layer. Josephson energy of the transmon-like device ("gatemon") is controlled by an electrostatic gate that depletes carriers in a…
Superconducting qubits are a promising platform for building a larger-scale quantum processor capable of solving otherwise intractable problems. In order for the processor to reach practical viability, the gate errors need to be further…
Universal quantum computers promise to solve computational problems that are beyond the capabilities of known classical algorithms. To realize such quantum hardware on a superconducting material platform, a vast number of physical qubits…
We describe a microfabrication process for superconducting through-silicon vias appropriate for use in superconducting qubit quantum processors. With a sloped-wall via geometry, we can use non-conformal metal deposition methods such as…
Spins in semiconductor quantum dots are a candidate for cryogenic quantum processors due to their exceptionally long coherence times. One major challenge to scaling quantum dot spin qubits is the dense wiring requirements, making it…
Superconducting quantum computer is manufactured based on semiconductor process which makes qubits integration possible. At the same time, this kind of qubit exhibits high performance fidelity, de-coherence time, scalability and requires a…
3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with…
State-of-the-art superconducting qubits rely on a limited set of thin-film materials. Expanding their materials palette can improve performance, extend operating regimes, and introduce new functionalities, but conventional thin-film…
Three-dimensional (3D) superconducting microwave cavities with large mode volumes typically have high quality factors ($>10^6$). This is due to a reduced sensitivity to surface dielectric losses, which is the limiting source of dissipation…