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The poor performance of copper interconnects at the nanometer scale calls for new material solutions for continued scaling of integrated circuits. We propose the use of three dimensional time-reversal-invariant topological insulators (TIs),…
Communication latency has become one of the determining factors for the performance of parallel clusters. To design low-latency network topologies for high-performance computing clusters, we optimize the diameters, mean path lengths, and…
In complex systems (e.g., communication, transportation, and biological networks), high robustness ensures sustained functionality and stability even when resisting attacks. However, the inherent structure complexity and the…
The theory of topological insulators and superconductors has mostly focused on non-interacting and gapped systems. This review article discusses topological phases that are either gapless or interacting. We discuss recent progress in…
This paper develops a multi-port S-parameter framework for the analysis and optimization of stacked intelligent metasurfaces (SIMs) with unilateral active interconnections. By modeling each unit cell as a non-reciprocal two-port network,…
Topos is an open interoperability protocol designed to reduce as much as possible trust assumptions by replacing them with cryptographic constructions and decentralization while exhibiting massive scalability. The protocol does not make use…
The drastic increase of bandwidth demands in AI datacenters requires new solutions with low power consumption and high bandwidth densities. Further increasing the total bandwidth with copper interconnects is challenging, thus it is crucial…
Data-driven based method for navigation and positioning has absorbed attention in recent years and it outperforms all its competitor methods in terms of accuracy and efficiency. This paper introduces a new architecture called IMUNet which…
Beyond conventional organic thin-film transistors, this thesis explores possible paths for the fourth wave of organic electronics. In this context, mixed ionic-electronic conductors and organic electro-chemical transistors (OECTs) are…
For a dielectric solid surrounded by an electrolyte and positioned inside an externally biased parallel-plate capacitor, we study numerically how the resulting induced-charge electro-osmotic (ICEO) flow depends on the topology and shape of…
An acoustic topological insulator (TI) is synthesized using topology optimization, a free material inverse design method. The TI appears spontaneously from the optimization process without imposing requirements on the existence of pseudo…
Interfacing artificial functional materials and living neuronal tissues is at the forefront of bio-nano-technology. Attempts have been so far based onto microscale processing of metals and inorganic semiconductors as electrodes or…
With their great scalability and flexibility, cascaded-bridge and modular multilevel converters have enabled a variety of energy applications, such as offshore wind power, high-voltage dc power transmission, power-quality management, and…
Recent years have witnessed the growing deployment of optical circuit switches (OCS) in commercial GPU clusters (e.g., Google A3 GPU cluster) optimized for machine learning (ML) workloads. Such clusters adopt a three-tier leaf-spine-OCS…
As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), the resulting complexity and manufacturing challenges continue…
Three dimensional (3D) topological insulators (TIs) are an important class of materials with applications in electronics, spintronics and quantum computing. With the recent development of truly bulk insulating 3D TIs, it has become possible…
Fault injection attacks exploit physical disturbances to compromise the functionality and security of integrated circuits. As System on Chip (SoC) architectures grow in complexity, the vulnerability of on chip communication fabrics has…
We predict a new family of robust two-dimensional (2D) topological insulators in van der Waals heterostructures comprising graphene and chalcogenides BiTeX (X=Cl, Br and I). The layered structures of both constituent materials produce a…
Advantages of hypercube network and torus topology are used to derive an embedded architecture for product network known as torus embedded hypercube scalable interconnection network. This paper analyzes torus embedded hypercube network…
Multi-plane architectures have become increasingly prevalent in the Fat-Tree networks of AI data centers. By leveraging multiple ports on a single network interface card (NIC) or multiple NICs within a scale-up domain, each port or NIC is…