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Compute in-memory (CIM) is a promising technique that minimizes data transport, the primary performance bottleneck and energy cost of most data intensive applications. This has found wide-spread adoption in accelerating neural networks for…
Repeated off-chip memory accesses to DRAM drive up operating power for data-intensive applications, and SRAM technology scaling and leakage power limits the efficiency of embedded memories. Future on-chip storage will need higher density…
Scalable persistent memory (PM) has opened up new opportunities for building indexes that operate and persist data directly on the memory bus, potentially enabling instant recovery, low latency and high throughput. When real PM hardware…
Homomorphic encryption (HE) allows direct computations on encrypted data. Despite numerous research efforts, the practicality of HE schemes remains to be demonstrated. In this regard, the enormous size of ciphertexts involved in HE…
Modern computing systems are embracing hybrid memory comprising of DRAM and non-volatile memory (NVM) to combine the best properties of both memory technologies, achieving low latency, high reliability, and high density. A prominent…
Computing-in-memory (CIM) is renowned in deep learning due to its high energy efficiency resulting from highly parallel computing with minimal data movement. However, current SRAM-based CIM designs suffer from long latency for loading…
In the last few years, research and development on Deep Learning models and techniques for ultra-low-power devices in a word, TinyML has mainly focused on a train-then-deploy assumption, with static models that cannot be adapted to newly…
Deep Learning Recommendation Models (DLRM) are widespread, account for a considerable data center footprint, and grow by more than 1.5x per year. With model size soon to be in terabytes range, leveraging Storage ClassMemory (SCM) for…
The rise of data-intensive applications exposed the limitations of conventional processor-centric von-Neumann architectures that struggle to meet the off-chip memory bandwidth demand. Therefore, recent innovations in computer architecture…
Large language models (LLMs) have been widely deployed for online generative services, where numerous LLM instances jointly handle workloads with fluctuating request arrival rates and variable request lengths. To efficiently execute…
Computing-In-Memory (CIM) offers a potential solution to the memory wall issue and can achieve high energy efficiency by minimizing data movement, making it a promising architecture for edge AI devices. Lightweight models like MobileNet and…
NAND flash memory is ubiquitous in everyday life today because its capacity has continuously increased and cost has continuously decreased over decades. This positive growth is a result of two key trends: (1) effective process technology…
Conventional wisdom holds that an efficient interface between an OS running on a CPU and a high-bandwidth I/O device should use Direct Memory Access (DMA) to offload data transfer, descriptor rings for buffering and queuing, and interrupts…
Non-volatile Memory (NVM) technologies present a promising alternative to traditional volatile memories such as SRAM and DRAM. Due to the limited availability of real NVM devices, simulators play a crucial role in architectural exploration…
Message Passing Interface (MPI) is a foundational programming model for high-performance computing. MPI libraries traditionally employ network interconnects (e.g., Ethernet and InfiniBand) and network protocols (e.g., TCP and RoCE) with…
Compute Express Link (CXL) 3.0 and beyond allows the compute nodes of a cluster to share data with hardware cache coherence and at the granularity of a cache line. This enables shared-memory semantics for distributed computing, but…
Memories that exploit three-dimensional (3D)-stacking technology, which integrate memory and logic dies in a single stack, are becoming popular. These memories, such as Hybrid Memory Cube (HMC), utilize a network-on-chip (NoC) design for…
To overcome the well-known memory bottleneck of AI chips, 3D stacked architectures that employ advanced packaging technology with high-density through-silicon vias (TSVs) pins have proven to be a promising solution. The 3D-stacked AI chip…
Compute-in-memory (CIM) presents an attractive approach for energy-efficient computing in data-intensive applications. However, the development of suitable memory designs to achieve high-performance CIM remains a challenging task. Here, we…
The trend in industry is towards heterogeneous multicore processors (HMCs), including chips with CPUs and massively-threaded throughput-oriented processors (MTTOPs) such as GPUs. Although current homogeneous chips tightly couple the cores…