Related papers: Optimization and Benchmarking of Monolithically St…
Accommodating all the weights on-chip for large-scale NNs remains a great challenge for SRAM based computing-in-memory (SRAM-CIM) with limited on-chip capacity. Previous non-volatile SRAM-CIM (nvSRAM-CIM) addresses this issue by integrating…
Prices of NAND flash memories are falling drastically due to market growth and fabrication process mastering while research efforts from a technological point of view in terms of endurance and density are very active. NAND flash memories…
Analog in-memory computing (AIMC) accelerators enable efficient deep neural network computation directly within memory using resistive crossbar arrays, where model parameters are represented by the conductance states of memristive devices.…
The rapid development of multi-core system and increase of data-intensive application in recent years call for larger main memory. Traditional DRAM memory can increase its capacity by reducing the feature size of storage cell. Now further…
To continue scaling beyond 2-D CMOS with 3-D integration, any new 3-D IC technology has to be comparable or better than 2-D CMOS in terms of scalability, enhanced functionality, density, power, performance, cost, and reliability.…
This paper introduces OPTIMUM-DERAM, a highly consistent, scalable, secure, and decentralized shared memory solution. Traditional distributed shared memory implementations offer multi-object support by multi-threading a single object memory…
The exponential growth in data generation and large-scale data analysis creates an unprecedented need for inexpensive, low-latency, and high-density information storage. This need has motivated significant research into multi-level memory…
The rapid adoption of large language models (LLMs) is pushing AI accelerators toward increasingly powerful and specialized designs. Instead of further complicating software development with deeply hierarchical scratchpad memories (SPMs) and…
Large language models (LLMs) have been widely deployed for online generative services, where numerous LLM instances jointly handle workloads with fluctuating request arrival rates and variable request lengths. To efficiently execute…
Memories that exploit three-dimensional (3D)-stacking technology, which integrate memory and logic dies in a single stack, are becoming popular. These memories, such as Hybrid Memory Cube (HMC), utilize a network-on-chip (NoC) design for…
Large language models (LLMs) exhibit memory-intensive behavior during decoding, making it a key bottleneck in LLM inference. To accelerate decoding execution, hybrid-bonding-based 3D-DRAM has been adopted in LLM accelerators. While this…
Storing digital information, ensuring the accuracy, steady and uninterrupted access to the data are considered as fundamental challenges in enterprise-class organizations and companies. In recent years, new types of storage systems such as…
Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally…
AI-powered edge devices currently lack the ability to adapt their embedded inference models to the ever-changing environment. To tackle this issue, Continual Learning (CL) strategies aim at incrementally improving the decision capabilities…
Non-volatile memory (NVM) is a class of promising scalable memory technologies that can potentially offer higher capacity than DRAM at the same cost point. Unfortunately, the access latency and energy of NVM is often higher than those of…
We demonstrate the first hardware implementation of an oscillatory neural network (ONN) utilizing resistive memory (ReRAM) for coupling elements. A ReRAM crossbar array chip, integrated into the Back End of Line (BEOL) of CMOS technology,…
Magneto-Electric FET (MEFET) is a recently developed post-CMOS FET, which offers intriguing characteristics for high speed and low-power design in both logic and memory applications. In this paper, for the first time, we propose a…
Emerging applications, such as big data analytics and machine learning, require increasingly large amounts of main memory, often exceeding the capacity of current commodity processors built on DRAM technology. To address this, recent…
The energy efficiency of analog computing-in-memory (ACIM) accelerator for recurrent neural networks, particularly long short-term memory (LSTM) network, is limited by the high proportion of nonlinear (NL) operations typically executed…
Although Large Language Models (LLMs) have demonstrated remarkable capabilities, their massive parameter counts and associated extensive computing make LLMs' deployment the main part of carbon emission from nowadays AI applications.…