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Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…
While reduction in feature size makes computation cheaper in terms of latency, area, and power consumption, performance of emerging data-intensive applications is determined by data movement. These trends have introduced the concept of…
High capacity and scalable memory systems play a vital role in enabling our desktops, smartphones, and pervasive technologies like Internet of Things (IoT). Unfortunately, memory systems are becoming increasingly prone to faults. This is…
Traditionally, specialized 3D design data, such as BIM and CAD, have been accessible only to a select group of experts, creating significant barriers that prevent general users from participating in decision-making processes. This paper…
This paper introduces a conceptual, yet quantifiable, architecture framework by extending the notion of system modularity in its broadest sense. Acknowledging that modularity is not a binary feature and comes in various types and levels,…
The design of complex materials and the formation of specific patterns often arise from the properties of the individual building blocks. In this respect, colloidal systems offer a unique opportunity because nowadays they can be synthesized…
3D city models - which represent in 3 dimensions the geometric elements of a city - are increasingly used for an intended wide range of applications. Such uses are made possible by using semantically enriched 3D city models and by…
Aside from the capability of additive manufacturing (AM) methods in fabricating components with complex geometries, two crucial potentials of this manufacturing process that are worth mentioning are its flexibility in being combined with…
Multilevel modeling and simulation (M&S) is becoming increasingly relevant due to the benefits that this methodology offers. Multilevel models allow users to describe a system at multiple levels of detail. From one side, this can make…
The paper describes multistage design of composite (modular) systems (i.e., design of a system trajectory). This design process consists of the following: (i) definition of a set of time/logical points; (ii) modular design of the system for…
In this article, the file system development design approaches are discussed. The selection of the file system design approach is done according to the needs of the developers what are the needed requirements and specifications for the new…
Polymer 3D printing is a broad set of manufacturing methods that permit the fabrication of complex architectures, and, as a result, numerous efforts focus on formulating processible chemistries that produce desirable material behavior in…
3D printing is considered the future of production systems and one of the physical elements of the Fourth Industrial Revolution. 3D printing will significantly impact the product lifecycle, considering cost, energy consumption, and carbon…
In literature computer architectures are frequently claimed to be highly flexible, typically implying there exist trade-offs between flexibility and performance or energy efficiency. Processor flexibility, however, is not very sharply…
Growing interest in semiconductor workforce development has generated demand for platforms capable of supporting large numbers of independent hardware designs for research and training without imposing high per-project overhead. Traditional…
3D shape creation and modeling remains a challenging task especially for novice users. Many methods in the field of computer graphics have been proposed to automate the often repetitive and precise operations needed during the modeling of…
Molecular self-assembly is a well-known technique to create highly functional nanostructures on surfaces. Self-assembly on two-dimensional materials is a developing field and has already resulted in the discovery of several rich and…
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…
There is a growing need for better development methods and tools to keep up with the increasing complexity of new software systems. New types of user interfaces, the need for intelligent components, sustainability concerns, ... bring new…
In this article, a new generic higher-order finite-element framework for massively parallel simulations is presented. The modular software architecture is carefully designed to exploit the resources of modern and future supercomputers.…