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With the growing role of artificial intelligence in climate and weather research, efficient model training and inference are in high demand. Current models like FourCastNet and AI-GOMS depend heavily on GPUs, limiting hardware independence,…
We present a new algorithm to design lightweight cellular materials with required properties in a multi-physics context. In particular, we focus on a thermo-mechanical setting, by promoting the design of unit cells characterized both by an…
Devices for performing computation and logic operations with low-energy consumption are of key importance for environmentally friendly data-processing and information technology. Here, we present a design for magnetic elements that use…
Multicore embedded systems have been constantly researched to improve the efficiency by changing certain metrics, such as processor, memory, cache hierarchies and their cache configurations. Using Multi2Sim and McPAT simulators in…
Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…
Ultra-high temperature ceramics, UHTCs, are a group of materials with high technological interest because their use in extreme environments. However, their characterization at high temperatures represents the main obstacle for their fast…
OpenIPMC is a free and open source firmware designed to operate as an Intelligent Platform Management Controller (IPMC). An IPMC is a fundamental component of electronic boards conformant to the Advanced Telecommunications Computing…
Hierarchical structures exhibit critical features across multiple scales. However, designing multiscale structures demands significant computational resources, and ensuring connectivity between microstructures remains a key challenge. To…
Large language models have achieved remarkable capabilities through scaling, and this paper does not challenge that. It instead investigates a different question: once large models already exist, can they become more accessible to…
Recent efforts in open-source GPU research are opening new avenues in a domain that has long been tightly coupled with a few commercial vendors. Emerging open GPU architectures define SIMT functionality through their own ISAs, but executing…
The Open Porous Media (OPM) initiative is a community effort that encourages open innovation and reproducible research for simulation of porous media processes. OPM coordinates collaborative software development, maintains and distributes…
Thermal management of power electronics and Electronic Control Units is crucial in times of increasing power densities and limited assembly space. Electric and autonomous vehicles are a prominent application field. Thermal Interface…
As core counts and heterogeneity rise in HPC, traditional hybrid programming models face challenges in managing distributed GPU memory and ensuring portability. This paper presents DiOMP, a distributed OpenMP framework that unifies OpenMP…
The successful integration of high-temperature superconductors (HTS) into modern technologies requires consistent, accessible, and comprehensive material data, a need that is currently unmet due to the fragmented and incomplete nature of…
Reliable artificial-intelligence models have the potential to accelerate the discovery of materials with optimal properties for various applications, including superconductivity, catalysis, and thermoelectricity. Advancements in this field…
As fusion energy devices advance, plasma simulations are crucial for reactor design. Our work extends BIT1 hybrid parallelization by integrating MPI with OpenMP and OpenACC, focusing on asynchronous multi-GPU programming. Results show…
This work summarizes recent progress on the thermal transport properties of three-dimensional (3D) nanostructures, with an emphasis on experimental results. Depending on the applications, different 3D nanostructures can be prepared or…
GPU-accelerated server platforms that share most of their hardware architecture often require separate firmware images due to minor hardware differences--different component identifiers, thermal profiles, or interconnect topologies. I built…
Aside from recent advances in artificial intelligence (AI) models, specialized AI hardware is crucial to address large volumes of unstructured and dynamic data. Hardware-based AI, built on conventional complementary metal-oxidesemiconductor…
This data set descriptor introduces a structured, high-resolution dataset of transient thermal simulations for a vertical axis of a machine tool test rig. The data set includes temperature and heat flux values recorded at 29 probe locations…