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Improving the heat transfer coefficient is crucial across various energy utilization processes for maintaining device safety and stability with high energy efficiency. However, in scenarios with limited heat capacity flow rates, increasing…
Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…
We introduce a new class of mesoscopic heat engines consisting of a tunnel junction coupled to a linear thermal bath. Work is produced by transporting electrons up against a voltage bias like in ordinary thermoelectrics but heat is…
Designing superconducting coils for a tokamak fusion device is a highly coupled, non-linear design problem. The coils have many disparate engineering requirements from structural to power electronics, as well strict limits placed on the…
Thermal or temperature management in modern machines has drawn great attentions in the last decades. The waste heat caused during the machine operation is particularly pernicious for the temperature-dependent electronics and may reduce the…
Self-heating is a severe problem for high-power GaN electronic and optoelectronic devices. Various thermal management solutions, e.g. flip-chip bonding or composite substrates have been attempted. However, temperature rise still limits…
As modern electronic devices are increasingly miniaturized and integrated, their performance relies more heavily on effective thermal management. Two-phase cooling methods enhanced by porous surfaces, which capitalize on thin-film…
Thermal management is an important challenge in modern electronics, avionics, automotive, and energy storage systems. While passive thermal solutions (like heat sinks or heat spreaders) are often used, actively modulating heat flow (e.g.…
A thermal position sensor was fabricated and evaluated. The device consists of an array of temperature sensing elements, fabricated entirely on a plastic substrate. A novel fabrication technology was implemented which allows direct…
As the variation of temperature alters the intrinsic carrier density in a semiconductor, numerical simulations indicate that the consequent variation of the relative permittivity in the terahertz regime provides a way to realize thermally…
Thermal management has become a promising field in recent years due to the limitation of energy resources and the global warming. An important topic in improving the efficiency of thermal energy utilization is how to control the flows of…
Thermal nonreciprocity plays a vital role in chip heat dissipation, energy-saving design, and high-temperature hyperthermia, typically realized through the use of advanced metamaterials with nonlinear, advective, spatiotemporal, or gradient…
The paper aims at demonstrating communication capabilities of IPT. For this data communication is performed between two modules using the concept of IPT. IPT was deemed to be the best solution to the system houses a multi parameter…
GaN-based HEMTs have the potential to be widely used in high-power and high-frequency electronics while their maximum output powers are limited by high channel temperature induced by near-junction Joule-heating, which degrades device…
Tuning interfacial thermal conductance has been a key task for the thermal management of nanoelectronic devices. Here, it is studied how the interfacial thermal conductance is great influenced by modulating the mass distribution of the…
The bottleneck in modern thermoelectric power generation and cooling is the low energy conversion efficiency of thermoelectric materials. The detrimental effects of lattice phonons on performance can be mitigated, but achieving a high…
Polyurethane (PU) is an ideal thermal insulation material due to its excellent thermal properties. The incorporation of Phase Change Materials (PCMs) capsules into Polyurethane (PU) has been shown to be effective in building envelopes. This…
This work proposes an extension of phase change and latent heat models for the simulation of metal powder bed fusion additive manufacturing processes on the macroscale and compares different models with respect to accuracy and numerical…
Thermal FEM (Finite Element Method) simulations can be used to predict the thermal behavior of power semiconductors in application. Most power semiconductors are made of silicon. Silicon thermal material properties are significantly…
The energy and thermal management systems of hybrid electric vehicles (HEVs) are inherently interdependent. With the ongoing deployment of intelligent transportation systems (ITSs) and increasing vehicle connectivity, the integration of…