Related papers: Designing for effective heat transfer in a solid t…
Due to embedded systems` stringent design constraints, much prior work focused on optimizing energy consumption and/or performance. Since embedded systems typically have fewer cooling options, rising temperature, and thus temperature…
Thermal management is a major challenge in next-generation high-performance computing systems, particularly for heterogeneous multi-chip packages such as the NVIDIA GB200 Grace Blackwell Superchip. In this work, a physics-based…
Heat pipe is one of the most efficient tools for heat dissipation in electronics and power systems. Currently, heat pipes are usually made of copper, aluminum or stainless steel. Due to their relatively high density and limited heat…
High power density systems require efficient cooling to maintain their thermal performance. Despite this, as systems get larger and more complex, human practice and insight may not suffice to determine the desired thermal management system…
Technical components are usually well optimized. However, simply combining these optimized components in a technical system does not necessarily lead to optimal systems. Therefore, focusing on a system perspective reveals new potential for…
Self-heating is a severe problem for high-power GaN electronic and optoelectronic devices. Various thermal management solutions, e.g. flip-chip bonding or composite substrates have been attempted. However, temperature rise still limits…
Enhanced geothermal systems (EGS) involve strongly coupled, advection-dominated flow and heat transfer in fractured porous media. Conventional models typically assume local thermal equilibrium with a single effective fluid temperature or,…
The transition to 4th generation district heating creates a growing need for scalable, automated design tools that accurately capture the spatial and temporal details of heating network operation. This paper presents an automated design…
This study investigates one of the possible approaches of improvement of heat exchangers efficiency. Literature review shows that most approaches of improvement are based on the heat transfer surface increasing and laminar-to-turbulent flow…
Thermophotovoltaic systems in principle enable utilization of heat that is usually regarded as wasted energy. However, the wavelength selectivity of the thermal emitter required for high efficiencies is rather difficult to control with…
Understanding heat transfer in composite materials is essential for optimizing their performance in critical applications across industries such as aerospace, automotive, renewable energy, and construction. This review offers a…
Self-heating is a severe problem for high-power microelectronic devices. Graphene and few-layer graphene have attracted tremendous attention for heat removal thanks to their extraordinarily high in-plane thermal conductivity. However, this…
Thermoelectric devices are heat engines, which operate as generators or refrigerators using the conduction electrons as a working fluid. The thermoelectric heat-to-work conversion efficiency has always been typically quite low, but much…
The work presented in this paper relates to a small scale district heating network heated by a gas fired CHP. In most common situations, such a CHP is heat driven operated, meaning that the CHP will switch on whenever heat is needed, while…
Modern district heating technologies have a great potential to make the energy sector more flexible and sustainable due to their capabilities to use energy sources of varied nature and to efficiently store energy for subsequent use. Central…
As modern electronic devices are increasingly miniaturized and integrated, their performance relies more heavily on effective thermal management. Two-phase cooling methods enhanced by porous surfaces, which capitalize on thin-film…
Heat exchangers are devices that typically transfer heat between two fluids. The performance of a heat exchanger such as heat transfer rate and pressure loss strongly depends on the flow regime in the heat transfer system. In this paper, we…
Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in order to make use of all the potential benefits of the vertical…
We are motivated to model a heat transfer to a multiple layer regime and their optimization for heat energy resources. Such a problem can be modeled by a porous media with different phases (liquid and solid). The idea arose of a geothermal…
Rapid growth in artificial intelligence (AI) workloads is driving up data center power densities, increasing the need for advanced thermal management. Direct-to-chip liquid cooling can remove heat efficiently at the source, but many cold…