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The computation of damping rates of an oscillating fluid with a free surface in which viscosity is small and surface tension high is numerically challenging. A typical application requiring such computation is drop-on-demand (DoD)…
For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor…
A direct electronics printing technique through atomized spraying for patterning room temperature liquid metal droplets on desired substrate surfaces is proposed and experimentally demonstrated for the first time. This method has…
It is known that 3D-ICs suffer from hot spot temperatures that can reach thousands of degrees, if they are not cooled to reasonable operating temperatures. The problem of hot spots is not limited to the high temperatures of the IC; thermal…
As modern electronic devices are increasingly miniaturized and integrated, their performance relies more heavily on effective thermal management. Two-phase cooling methods enhanced by porous surfaces, which capitalize on thin-film…
Selective Laser Melting (SLM) is an additive manufacturing technology that builds three dimensional parts by melting layers of metal powder together with a laser that traces out a desired geometry. SLM is popular in industry, however the…
Improving the heat transfer coefficient is crucial across various energy utilization processes for maintaining device safety and stability with high energy efficiency. However, in scenarios with limited heat capacity flow rates, increasing…
We present the design, construction and characterization of Bitter-type electromagnets which can generate high magnetic fields under continuous operation with efficient heat removal for cold atom experiments. The electromagnets are…
The flow patterns created by a coherent horizontal liquid jet impinging on a vertical wall atmoderate flow rates (jet flowrates 0.5-4.0 L min-1, jet velocities 2.6-21 m s-1) are studied withwater on glass, polypropylene and…
We present a thermal activated solvent bonding technique for the formation of embedded microstrucutres in polymer. It is based on the temperature dependent solubility of polymer in a liquid that is not a solvent at room temperature. With…
Turbulent mixers have been widely used in industrial settings for chemical production and increasingly for therapeutic nanoparticle formulation by antisolvent precipitation. The quality of the product is closely related to the fluid and…
A novel photonic thermal diode concept operating in the near field and capitalizing on the temperature-dependence of coupled surface polariton modes in nanostructures is proposed. The diode concept utilizes terminals made of the same…
A solution for the most important problems in 3D printing technology (long print times, small build volumes and limited material properties) is proposed. Method is based on the fact that temperature of melts crystallization can be shifted…
The trapped-ion quantum charge-coupled device (QCCD) architecture is a leading candidate for advanced quantum information processing. In current QCCD implementations, imperfect ion transport and anomalous heating can excite ion motion…
We present the calculation for single-inclusive jet production in (longitudinally) polarized deep-inelastic lepton-nucleon scattering at next-to-next-to leading order (NNLO) accuracy, based on the Projection-to-Born method. As a necessary…
Steam condensation on the surface of a solid is a widely observed mode of energy transfer in nature and various industrial applications. The condensation efficiency is closely related to the material properties and geometric morphology of…
Liquid Helium is used widely, from hospitals to characterization of materials at low temperatures. Many experiments at low temperatures require liquid Helium, particularly when vibration isolation precludes the use of cryocoolers and when…
Additive manufacturing is becoming a technique with great prospects for the production of components with new designs or shapes that are difficult to obtain by conventional manufacturing methods. One of the most promising techniques for…
We present a new multi-fluid, multi-temperature plasma solver with adaptive Cartesian mesh (ACM) based on a full-Newton (non-linear, implicit) scheme for collisional low-temperature plasma. The particle transport is described using the…
A novel type of particle "cooling", called Ionization Cooling, is applicable to slow (v of the order of 0.1c) ions stored in a small ring. The many traversals through a thin foil enhance the nuclear reaction probability, in a steady…