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This paper proposes a computationally efficient simulation strategy for cold thermal energy storage (TES) systems based on phase change material (PCM). Taking as a starting point the recent design of a TES system based on PCM, designed to…

Systems and Control · Electrical Eng. & Systems 2024-02-07 G. Bejarano , M. Vargas , M. G. Ortega , F. Castaño , J. E. Normey-Rico

Probabilistic graphical models (PGMs) serve as a powerful framework for modeling complex systems with uncertainty and extracting valuable insights from data. However, users face challenges when applying PGMs to their problems in terms of…

Machine Learning · Computer Science 2024-05-29 Jiantong Jiang , Zeyi Wen , Peiyu Yang , Atif Mansoor , Ajmal Mian

We present efficient algorithms to build data structures and the lists needed for fast multipole methods. The algorithms are capable of being efficiently implemented on both serial, data parallel GPU and on distributed architectures. With…

Mathematical Software · Computer Science 2013-01-10 Qi Hu , Nail A. Gumerov , Ramani Duraiswami

Thermal FEM (Finite Element Method) simulations can be used to predict the thermal behavior of power semiconductors in application. Most power semiconductors are made of silicon. Silicon thermal material properties are significantly…

General Physics · Physics 2008-01-08 V. Kosel , R. Sleik , M. Glavanovics

Geospatial Processing, such as queries based on point-to-polyline shortest distance and point-in-polygon test, are fundamental to many scientific and engineering applications, including post-processing large-scale environmental and climate…

Databases · Computer Science 2014-03-05 Jianting Zhang Simin You

Optimizing task-to-core allocation can substantially reduce power consumption in multi-core platforms without degrading user experience. However, existing approaches overlook critical factors such as parallelism, compute intensity, and…

Distributed, Parallel, and Cluster Computing · Computer Science 2026-01-13 Mohammad Pivezhandi , Abusayeed Saifullah , Prashant Modekurthy

Multi-Processor Systems-on-Chip (MPSoC) can deliver high performance needed in many industrial domains, including aerospace. However, their high power consumption, combined with avionics safety standards, brings new thermal management…

Software Engineering · Computer Science 2025-06-23 Ondřej Benedikt , Michal Sojka , Přemysl Šůcha , Pavel Zaykov , Zdeněk Hanzálek

Estimating the material properties of thermal protection films is crucial for their effective design and application, particularly in high-temperature environments. This work presents a novel approach to determine the properties using…

Computational Engineering, Finance, and Science · Computer Science 2025-01-22 Karthik Reddy Lyathakula

Accurate and efficient temperature prediction is critical for optimizing the preheating process of PET preforms in industrial microwave systems prior to blow molding. We propose a novel deep learning framework for generalized temperature…

Machine Learning · Computer Science 2025-10-08 Ahmad Alsheikh , Andreas Fischer

The current study aims to develop a non-intrusive Reduced Order Model (ROM) to reconstruct the full temperature field for a large-scale industrial application based on both numerical and experimental datasets. The proposed approach is…

We calculate thermodynamic quantities of HP lattice proteins by means of a multicanonical chain growth algorithm that connects the new variants of the Pruned-Enriched Rosenbluth Method (nPERM) and flat histogram sampling of the entire…

Soft Condensed Matter · Physics 2009-11-10 Michael Bachmann , Wolfhard Janke

In this work, we present an approach for the efficient treatment of parametrized geometries in the context of POD-Galerkin reduced order methods based on Finite Volume full order approximations. On the contrary to what is normally done in…

Numerical Analysis · Mathematics 2020-02-07 Giovanni Stabile , Matteo Zancanaro , Gianluigi Rozza

Chiplet-based integration enables large-scale systems that combine diverse technologies, enabling higher yield, lower costs, and scalability, making them well-suited to AI workloads. Processing-in-Memory (PIM) has emerged as a promising…

Hardware Architecture · Computer Science 2025-08-15 Alish Kanani , Lukas Pfromm , Harsh Sharma , Janardhan Rao Doppa , Partha Pratim Pande , Umit Y. Ogras

In this paper we evaluate the use of system identification methods to build a thermal prediction model of heterogeneous SoC platforms that can be used to quickly predict the temperature of different configurations without the need of…

Machine Learning · Computer Science 2021-12-21 Joel Öhrling , Sébastien Lafond , Dragos Truscan

A modern graphics processing unit (GPU) is able to perform massively parallel scientific computations at low cost. We extend our implementation of the checkerboard algorithm for the two dimensional Ising model [T. Preis et al., J. Comp.…

Computational Physics · Physics 2010-07-22 Benjamin Block , Peter Virnau , Tobias Preis

We utilize the Open Accelerator (OpenACC) approach for graphics processing unit (GPU) accelerated particle-resolved thermal lattice Boltzmann (LB) simulation. We adopt the momentum-exchange method to calculate fluid-particle interactions to…

Fluid Dynamics · Physics 2023-10-06 Ao Xu , Bo-Tao Li

Accurate prediction of thermal runaway in lithium-ion batteries is essential for ensuring the safety, efficiency, and reliability of modern energy storage systems. Conventional data-driven approaches, such as Long Short-Term Memory (LSTM)…

Machine Learning · Computer Science 2026-05-12 Salman Khan , Syed Sajid Ullah , Muhammad Zunair Zamir , Jie Li , Abdul Malik , Saeed Mian Qaisar

Graphics processing units have been extensively used to accelerate classical molecular dynamics simulations. However, there is much less progress on the acceleration of force evaluations for many-body potentials compared to pairwise ones.…

Computational Physics · Physics 2017-06-27 Zheyong Fan , Wei Chen , Ville Vierimaa , Ari Harju

Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…

Hardware Architecture · Computer Science 2026-04-07 Baibhari Priya Barua , Md Rahatul Islam Udoy , Ahmedullah Aziz

The thermal conductivity of Functionally Graded Materials (FGMs) can be efficiently designed through topology optimization to obtain thermal meta-structures that actively steer the heat flow. Compared to conventional analytical design…

Computational Engineering, Finance, and Science · Computer Science 2024-12-04 Chintan Jansari , Stéphane P. A. Bordas , Marco Montemurro , Elena Atroshchenko
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