Related papers: Anisotropic thermal conductivity of high bandwidth…
In this article, we are proposing a thorough analysis of the cross, and the in-plane thermal conductivity of thin-film materials based on the 3$\omega$ method. The analysis accommodates a 2D mathematical heat transfer model of a…
Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…
Anisotropic thermal transport plays a key role in both theoretical study and engineering practice of heat transfer, but accurately measuring anisotropic thermal conductivity remains a significant challenge. To address this issue, we propose…
For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor…
The reduction of the thermal conductivity in nanostructures opens up the possibility of exploiting for thermoelectric purposes also materials such as silicon, which are cheap, available and sustainable but with a high thermal conductivity…
Accurately measuring the thermal properties of buried interfaces is crucial for understanding heat transport in multilayered materials, particularly in applications such as batteries and integrated circuits. The conventional 3$\omega$…
The 3$\omega$ method is a dynamic measurement technique developed for determining the thermal conductivity of thin films or semi-infinite bulk materials. A simplified model is often applied to deduce the thermal conductivity from the slope…
We developed a novel contactless frequency-domain approach to study thermal transport, which is particularly convenient when thermally anisotropic materials are considered. The method is based on a similar line-shaped heater geometry as…
The accurate determination of thermal conductivity $\kappa(T)$ in bulk materials at room temperature and above is crucial for evaluating their compatibility for specific applications. The 3$\omega$ technique is an established methodology…
Organic thin film materials with molecular ordering are gaining attention as they exhibit semiconductor characteristics. When using them for electronics, the thermal management becomes important, where heat dissipation is directional owning…
3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…
Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in order to make use of all the potential benefits of the vertical…
\b{eta}-Ga2O3 has attracted considerable interest in recent years for high power electronics, where thermal properties of \b{eta}-Ga2O3 play a critical role. The thermal conductivity of \b{eta}-Ga2O3 is expected to be three-dimensionally…
Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally…
A systematic study was performed to measure the effective thermal conductivity of ceramic particle beds, a promising heat transfer and thermal energy storage media for concentrating solar power (CSP). The thermal conductivity of the ceramic…
As artificial intelligence (AI) chips become more powerful, the thermal management capabilities of conventional silicon (Si) substrates become insufficient for 3D-stacked designs. This work integrates electrically insulative and thermally…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
It is known that 3D-ICs suffer from hot spot temperatures that can reach thousands of degrees, if they are not cooled to reasonable operating temperatures. The problem of hot spots is not limited to the high temperatures of the IC; thermal…
We examine the long-standing cooling flow problem in galaxy clusters with 3D MHD simulations of isolated clusters including radiative cooling and anisotropic thermal conduction along magnetic field lines. The central regions of the…
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However,…