Related papers: Boosting the 3D thermal-aware floorplanning proble…
3D stacked technology has emerged as an effective mechanism to overcome physical limits and communication delays found in 2D integration. However, 3D technology also presents several drawbacks that prevent its smooth application. Two of the…
Temperature affects not only the reliability but also the performance, power, and cost of the embedded system. This paper proposes a thermal-aware task allocation and scheduling algorithm for embedded systems. The algorithm is used as a…
During the earliest phase of architectural design process, practitioners after analyzing the client's design program, legal requirements, topographic constraints, and preferences synthesize these requirements into architectural floor plan…
This paper describes a method combining Bayesian optimization (BO) and a lamped-capacitance thermal circuit network model that is effective for speeding up the thermal design optimization of an electronic circuit board layout with transient…
Chiplet-based systems have gained significant attention in recent years due to their low cost and competitive performance. As the complexity and compactness of a chiplet-based system increase, careful consideration must be given to…
The adoption of machine learning-based techniques for analog integrated circuit layout, unlike its digital counterpart, has been limited by the stringent requirements imposed by electric and problem-specific constraints, along with the…
Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in order to make use of all the potential benefits of the vertical…
Analyzing data centers with thermal-aware optimization techniques is a viable approach to reduce energy consumption of data centers. By taking into account thermal consequences of job placements among the servers of a data center, it is…
In heterogeneous integration, different dies may employ distinct technologies, making floorplanning across multiple dies inherently coupled with technology assignment. By assuming a fixed technology, almost all prior floorplanning studies…
Reliability management is one of the primary concerns in manycore systems design. Different aging mechanisms such as Negative-Bias Temperature Instability (NBTI), Electromigration (EM), and thermal cycling can reduce the reliability of…
Analog integrated circuit (IC) floorplanning is typically a manual process with the placement of components (devices and modules) planned by a layout engineer. This process is further complicated by the interdependence of floorplanning and…
Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous systems typically prioritizes wirelength reduction through tight…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
A prototype tool to assist architects during the early design stage of floor plans has been developed, consisting of an Evolutionary Program for the Space Allocation Problem (EPSAP), which generates sets of floor plan alternatives according…
Modern real-time systems utilize considerable amounts of power while executing computation-intensive tasks. The execution of these tasks leads to significant power dissipation and heating of the device. It therefore results in severe…
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However,…
We study scheduling problems motivated by recently developed techniques for microprocessor thermal management at the operating systems level. The general scenario can be described as follows. The microprocessor's temperature is controlled…
Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction models can perform real-time prediction for many…
Thermal-aware workload distribution is a common approach in the literature for power consumption optimization in data centers. However, data centers also have other operational costs such as the cost of equipment maintenance and…
Due to embedded systems` stringent design constraints, much prior work focused on optimizing energy consumption and/or performance. Since embedded systems typically have fewer cooling options, rising temperature, and thus temperature…