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This manuscript proposes an optimization framework to find the tailor-made functionally graded material (FGM) profiles for thermoelastic applications. This optimization framework consists of (1) a random profile generation scheme, (2) deep…

Computational Engineering, Finance, and Science · Computer Science 2024-08-27 Piyush Agrawal , Ihina Mahajan , Shivam Choubey , Manish Agrawal

This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…

Materials Science · Physics 2007-09-13 Peter E. Raad , Pavel L. Komarov , M. Burzo

The challenge of applying learned knowledge from one domain to solve problems in another related but distinct domain, known as transfer learning, is fundamental in operator learning models that solve Partial Differential Equations (PDEs).…

Machine Learning · Computer Science 2024-08-21 Haoyang Jiang , Yongzhi Qu

As the role played by statistical and computational sciences in climate and environmental modelling and prediction becomes more important, Machine Learning researchers are becoming more aware of the relevance of their work to help tackle…

Machine Learning · Statistics 2020-12-23 Federico Amato , Fabian Guignard , Sylvain Robert , Mikhail Kanevski

Large-scale cryogenic Input-Output (IO) infrastructure is a requirement for realising fault-tolerant quantum computing in solid-state modalities. Such IO scaling presents significant challenges in thermal modelling, hardware design and…

Quantum Physics · Physics 2025-03-17 Scott A. Manifold , George B. Long , Jonathan J. Burnett

High stress occurs when 3D heterogeneous IC packages are subjected to thermal cycling at extreme temperatures. Stress mainly occurs at the interface between different materials. We investigate stress image using latent space representation…

Machine Learning · Computer Science 2026-02-26 Kart Leong Lim , Ji Lin

The current study aims to develop a non-intrusive Reduced Order Model (ROM) to reconstruct the full temperature field for a large-scale industrial application based on both numerical and experimental datasets. The proposed approach is…

Partial Differential Equations (PDEs) are widely used for modeling the physical phenomena and analyzing the dynamical behavior of many engineering and physical systems. The heat equation is one of the most well-known PDEs that captures the…

Logic in Computer Science · Computer Science 2022-08-16 Elif Deniz , Adnan Rashid , Osman Hasan , Sofiène Tahar

Deep learning has emerged as a transformative tool for the neural surrogate modeling of partial differential equations (PDEs), known as neural PDE solvers. However, scaling these solvers to industrial-scale geometries with over $10^8$ cells…

Machine Learning · Computer Science 2026-02-06 Hang Zhou , Haixu Wu , Haonan Shangguan , Yuezhou Ma , Huikun Weng , Jianmin Wang , Mingsheng Long

Using detailed simulations of calorimeter showers as training data, we investigate the use of deep learning algorithms for the simulation and reconstruction of particles produced in high-energy physics collisions. We train neural networks…

3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…

Applied Physics · Physics 2019-11-04 Chandrasekhar Mandalapu , Ibrahim M Abdel-Motaleb , Sangki Hong , Robert Patti

Modern real-time systems utilize considerable amounts of power while executing computation-intensive tasks. The execution of these tasks leads to significant power dissipation and heating of the device. It therefore results in severe…

Systems and Control · Electrical Eng. & Systems 2024-02-07 Anthony Dowling , Lin Jiang , Ming-Cheng Cheng , Yu Liu

The classical proper orthogonal decomposition (POD) with the Galerkin projection (GP) has been revised for chip-level thermal simulation of microprocessors with a large number of cores. An ensemble POD-GP methodology (EnPOD-GP) is…

Computational Engineering, Finance, and Science · Computer Science 2024-04-16 Lin Jian , Yu Liu , Ming-Cheng Cheng

This paper presents the building heating demand prediction model with occupancy profile and operational heating power level characteristics in short time horizon (a couple of days) using artificial neural network. In addition, novel pseudo…

Computational Engineering, Finance, and Science · Computer Science 2014-11-19 S. Paudel , M. Elmtiri , W. L. Kling , O. Le Corre , B. Lacarriere

As mechanical systems become more complex and technological advances accelerate, the traditional reliance on heritage designs for engineering endeavors is being diminished in its effectiveness. Considering the dynamic nature of the design…

Systems and Control · Electrical Eng. & Systems 2023-10-26 Saeid Bayat , Nastaran Shahmansouri , Satya RT Peddada , Alex Tessier , Adrian Butscher , James T Allison

We present a novel 3D adaptive observer framework for use in the determination of subsurface organic tissue temperatures in electrosurgery. The observer structure leverages pointwise 2D surface temperature readings obtained from a real-time…

Computer Vision and Pattern Recognition · Computer Science 2022-11-02 Hamza El-Kebir , Junren Ran , Martin Ostoja-Starzewski , Richard Berlin , Joseph Bentsman , Leonardo P. Chamorro

Intelligent detection and processing capabilities can be instrumental to improving the safety, efficiency, and successful completion of rescue missions conducted by firefighters in emergency first response settings. The objective of this…

Computer Vision and Pattern Recognition · Computer Science 2020-04-21 Manish Bhattarai , Manel Martínez-Ramón

The presence of defects strongly influences semiconductor behavior. However, predicting the electronic properties of defective materials at finite temperatures remains computationally expensive even with density functional theory due to the…

Materials Science · Physics 2025-11-25 Xiangzhou Zhu , Patrick Rinke , David A. Egger

Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…

Hardware Architecture · Computer Science 2026-04-07 Baibhari Priya Barua , Md Rahatul Islam Udoy , Ahmedullah Aziz

We introduce a machine-learning framework to warm-start fixed-point optimization algorithms. Our architecture consists of a neural network mapping problem parameters to warm starts, followed by a predefined number of fixed-point iterations.…

Optimization and Control · Mathematics 2023-09-15 Rajiv Sambharya , Georgina Hall , Brandon Amos , Bartolomeo Stellato