Related papers: RD53A pixel module assembly and testing experience
The ATLAS detector has to undergo significant updates at the end of the current decade, in order to withstand the increased occupancy and radiation damage that will be produced by the high-luminosity upgrade of the Large Hadron Collider. In…
High Voltage CMOS sensors are a promising technology for tracking detectors in collider experiments. Extensive R&D studies are being carried out by the ATLAS Collaboration for a possible use of HV-CMOS in the High Luminosity LHC upgrade of…
The High Luminosity upgrade of the CERN Large Hadron Collider will be able to reach a peak instantaneous luminosity of 5E34/cm2 s. The innermost detectors of the CMS and ATLAS experiments will have to cope with unprecedented requirements on…
We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 $\mu$m thick, produced at VTT…
3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are…
We are investigating the feasibility of using CMOS foundries to fabricate silicon detectors, both for pixels and for large-area strip sensors. The availability of multi-layer routing will provide the freedom to optimize the sensor geometry…
During the second LHC long shutdown (LS2) the Inner Tracking System (ITS) of ALICE (A Large Ion Collider Experiment) will be replaced by seven layers of CMOS Monolithic Active Pixel Sensors (MAPS). The latest innovations in silicon imaging…
The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer…
The High Luminosity Large Hadron Collider (HL-LHC) at CERN is expected to collide protons at a center-of-mass energy of 14 TeV and to reach the unprecedented peak instantaneous luminosity of $7.5 \times 10^{34} \text{cm}^{-2} \text{s}^{-1}$…
Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about…
To cope with the higher occupancy and radiation damage at the HL-LHC also the LHC experiments will be upgraded. The ATLAS Planar Pixel Sensor R&D Project (PPS) is an international collaboration of 17 institutions and more than 80…
3D silicon detectors, in which the electrodes penetrate the sensor bulk perpendicular to the surface, have recently undergone a rapid development from R\&D over industrialisation to their first installation in a real high-energy-physics…
The LHCb detector has undergone a major upgrade for LHC Run 3. This Upgrade I detector facilitates operation at higher luminosity and utilises full-detector information at the LHC collision rate, critically including the use of vertex…
Pixel sensors in 3D technology equip the outer ends of the staves of the Insertable B Layer (IBL), the innermost layer of the ATLAS Pixel Detector, which was installed before the start of LHC Run 2 in 2015. 3D pixel sensors are expected to…
An upgrade of the ATLAS experiment for the High Luminosity phase of LHC is planned for 2024 and foresees the replacement of the present Inner Detector (ID) with a new Inner Tracker (ITk) completely made of silicon devices. Depleted active…
During Large Hadron Collider (LHC) Long Shutdown 3 (LS3) (2026-28), the ALICE experiment is replacing its inner-most three tracking layers by a new detector, Inner Tracking System 3. It will be based on newly developed wafer-scale…
After the successful installation and first operation of the new Inner Tracking System (ITS2), which consists of about 10 m$^2$ of monolithic silicon pixel sensors, ALICE is pioneering the usage of bent, wafer-scale pixel sensors for the…
The two innermost layers of the ALICE inner tracking system are instrumented with silicon pixel detectors. Single chip assembly prototypes of the ALICE pixels have been tested in high energy particle beams at the CERN SPS. Detection…
The ALICE Collaboration will undertake a major upgrade of the detector apparatus during the second LHC Long Shutdown LS2 (2019-2020) in view of the Runs 3 and 4 (2021-2029). The objective of the upgrade is two-fold: i) an improvement of the…
The semiconductor tracker (SCT) is one of the tracking systems for charged particles in the ATLAS detector. It consists of 4088 silicon strip sensor modules. During Run 2 (2015$-$2018) the Large Hadron Collider delivered an integrated…