Related papers: Deep multilevel wet etching of fused silica glass …
Glass materials play an increasingly important role in advanced technologies due to their superior physical properties. However, precise machining of glass remains a major challenge because of its brittleness and sensitivity to thermal and…
Large-scale microfluidic microsystems with complex three-dimensional (3D) configurations are highly in demand by both fundamental research and industrial application, holding the potentials for fostering a wide range of innovative…
Fused silica glass is the preferred material in all applications which require long-term chemical and mechanical stability as well as excellent optical properties. The manufacturing of complex hollow microstructures within transparent fused…
We demonstrate a hybrid laser microfabrication approach, which combines the technical merits of ultrafast laser-assisted chemical etching and carbon dioxide laser-induced in-situ melting, for centimeter-scale and bonding-free fabrication of…
High-purity glasses are used for their low optical and mechanical loss, which makes them an excellent material for oscillators in optical systems, such as inertial sensors. Complex geometries often require the assembly of multiple pieces of…
We report on the fabrication of micro-axicons made of glass by laser-assisted wet etching (LAE) and laser polishing. The employed technique, relying on an efficient direct-writing process by femtosecond laser, allows revealing high fidelity…
We describe a technique for surface and sub-surface micro-machining of glass substrates using tightly focused femtosecond laser pulses at a wavelength of 1660 nm. Although silicate glass is normally transparent at this wavelength, the…
Silicon carbide (SiC) is a semiconductor used in quantum information processing, microelectromechanical systems, photonics, power electronics, and harsh environment sensors. However, its high temperature stability, high breakdown voltage,…
We report on the development of some process capabilities for a polymer-based, multi-layer microelectrofluidic platform, namely: the hot embossing process, metallization on polymer and polymer bonding. Hot embossing experiments were…
It is well known that when the fused silica is irradiated with focused femtosecond laser beams, space selective chemical etching can be achieved. The etching rate depends sensitively on the polarization of the laser. Surprisingly, we…
Due to its exceptional dimensional stability in harsh thermal conditions and excellent mechanical and optical properties, Corning ultra-low expansion (ULE) glass is the material of choice in many high-demanding fields such as aerospace,…
Three-dimensional (3D) printing has allowed for production of geometrically complex 3D objects with extreme flexibility, which is currently undergoing rapid expansions in terms of materials, functionalities, as well as areas of application.…
Many biological materials exhibit a multiscale porosity with small, mostly nanoscale pores as well as large, macroscopic capillaries to simultaneously achieve optimized mass transport capabilities and lightweight structures with large inner…
The synthesis and texturization processes of fluorinated surfaces by means of atmospheric plasma are investigated and presented through an integrated study of both the plasma phase and the resulting material surface. Three methods enhancing…
Reducing the fabrication cost of photonic integrated circuits while maintaining low optical losses and technological simplicity is essential for their wider implementation. In conventional manufacturing methods, the dielectric cladding…
Wet etching is an essential and complex step in semiconductor device processing. Metal-Assisted Chemical Etching (MacEtch) is fundamentally a wet but anisotropic etching method. In the MacEtch technique, there are still a number of…
The requirement for low operational voltage in electrowetting devices, met using thin dielectrics, is usually connected with serious material failure issues. Dielectric breakdown (visible as electrolysis) is frequently evident slightly…
Recently-demonstrated high-quality three-dimensional (3D) subsurface laser processing inside crystalline silicon (c-Si) wafers opens a door to a wide range of novel applications in multidisciplinary research areas. Using this technique, a…
Microfluidics have emerged as a vital tool in various scientific and engineering applications, ranging from biomedical diagnostics to chemical analysis. However, conventional fabrication methods often necessitate costly equipment and…
Nowadays, microelectronics and nanoelectronics require the search for new materials, including masks for creating structures. Today, the intermediate hard mask strategy is one of the key issues in achieving a good balance between…