Related papers: Pixel detector hybridisation with Anisotropic Cond…
The ALICE ITS3 (Inner Tracking System 3) upgrade project and the CERN EP R&D on monolithic pixel sensors are investigating the feasibility of the Tower Partners Semiconductor Co. 65 nm process for use in the next generation of vertex…
Visible-spectrum photonic integrated circuits (PICs) present compact and scalable solutions for emerging technologies including quantum computing, biosensing, and virtual/augmented reality. Realizing their full potential requires the…
CMOS Pixel Sensors tend to become relevant for a growing spectrum of charged particle detection instruments. This comes mainly from their high granularity and low material budget. However, several potential applications require a higher…
Sensor fusion of camera, LiDAR, and 4-dimensional (4D) Radar has brought a significant performance improvement in autonomous driving. However, there still exist fundamental challenges: deeply coupled fusion methods assume continuous sensor…
Due to their radiation hardness, kilohertz frame rates, and high dynamic range, hybrid pixel detectors have recently expanded their application range to electron diffraction and recently also electron imaging. However, these detectors…
Timepix and Timepix3 are hybrid pixel detectors ($256\times 256$ pixels), capable of tracking ionizing particles as isolated clusters of pixels. To efficiently analyze such clusters at potentially high rates, we introduce multiple…
We have developed a silicon pixel detector to enhance the physics capabilities of the PHENIX experiment. This detector, consisting of two layers of sensors, will be installed around the beam pipe at the collision point and covers a…
CMOS sensors were successfully implemented in the STAR tracker [1]. LHC experiments have shown that efficient b tagging, reconstruction of displaced vertices and identification of disappearing tracks are necessary. An improved vertex…
Amorphous silicon carbide (a-SiC) has emerged as a compelling candidate for applications in integrated photonics, known for its high refractive index, high optical quality, high thermo-optic coefficient, and strong third-order…
This paper presents the design of a new monolithic Silicon-On-Insulator pixel sensor in $200~nm$ SOI CMOS technology. The main application of the proposed pixel detector is the spectroscopy, but it can also be used for the minimum ionizing…
The ATLAS Forward Physics (AFP) project plans to install 3D silicon pixel detectors about 210 m away from the interaction point and very close to the beamline (2-3 mm). This implies the need of slim edges of about 100-200 $\mu$m width for…
Following the Phase-II upgrade during Long Shutdown (LS3), the LHC aims to reach a peak instantaneous luminosity of $7.5\times 10^{34}$cm$^{-2}$s$^{-1}$, which corresponds to an average of around 200 inelastic proton-proton collisions per…
Photonic integrated circuits (PICs) have emerged as a scalable platform for complex quantum technologies using photonic and atomic systems. A central goal has been to integrate photon-resolving detectors to reduce optical losses, latency,…
The Adaptive Gain Integrating Pixel Detector (AGIPD) is a novel detector system, currently under development by a collaboration of DESY, the Paul Scherrer Institute in Switzerland, the University of Hamburg and the University of Bonn, and…
In order to fully exploit the physics potential of the future high energy e+e- linear collider, a Vertex Tracker able to provide particle track extrapolation with very high resolution is needed. Hybrid Si pixel sensors are an attractive…
The latest generation of Timepix series hybrid pixel detectors enhance particle tracking with high spatial and temporal resolution. However, their high hit-rate capability poses challenges for data processing, particularly in multidetector…
The concept of capacitive coupling between sensors and readout chips is under study for the vertex detector at the proposed high-energy CLIC electron positron collider. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is an active…
Integrated photonic platforms have proliferated in recent years, each demonstrating its own unique strengths and shortcomings. However, given the processing incompatibilities of different platforms, a formidable challenge in the field of…
The ALICE collaboration is preparing an upgrade of the three innermost layers of the current Inner Tracking System (ITS) during the next LHC long shutdown (LS3). The new ITS detector will use wafer-scale (up to \SI{27}{cm} in length)…
Integration of superconducting nanowire single photon detectors and quantum sources with photonic waveguides is crucial for realizing advanced quantum integrated circuits. However, scalability is hindered by stringent requirements on high…