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3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…
On the advent of the slow death of Moore's law, the silicon industry is moving towards a new era of chiplets. The automotive industry is experiencing a profound transformation towards software-defined vehicles, fueled by the surging demand…
Dedicated, after acceptance and publication, in memory of the late Vassos Soteriou. For the first time, we leverage the 2.5D interposer technology to establish system-level security in the face of hardware- and software-centric adversaries.…
Optical I/O technologies have emerged as a potential industrial solution for high-performance data interconnection in AI/ML computing acceleration. While optical I/Os are deployed at the edge of computational chips by co-packaged optics…
The growing demand for compute-intensive applications has made multi-chiplet architectures a promising alternative to monolithic designs, offering improved scalability and manufacturing flexibility. However, effectively managing the…
Driven by a need for ever increasing chip performance and inclusion of innovative features, a growing number of semiconductor companies are opting for all-inclusive System-on-Chip (SoC) architectures. Although Moore's Law has been able to…
Achieving high performance, energy efficiency, and cost-effectiveness while maintaining architectural flexibility is a critical challenge in the development and deployment of edge AI devices. Monolithic SoC designs struggle with this…
By interconnecting smaller chiplets through an interposer, 2.5D integration offers a cost-effective and high-yield solution to implement large-scale modular systems. Nevertheless, the underlying network is prone to deadlock, despite…
Trapped ions are among the most promising platforms for realizing a large-scale quantum information processor. Current progress focuses on integrating optical and electronic components into microfabricated ion traps to allow scaling to…
The growing complexity of real-time control algorithms with increasing performance demands, along with the shift to 2.5D technology, drive the need for scalable controllers to manage chiplets' coupled operation in 2.5D systems-in-package.…
Leveraging 2.5D interposer technology, we advocate the integration of untrusted commodity components/chiplets with physically separate, entrusted logic components. Such organization provides a modern root of trust for secure system-level…
With transistor scaling reaching its limits, interposer-based integration of dies (chiplets) is gaining traction. Such an interposer-based integration enables finer and tighter interconnect pitch than traditional system-on-packages and…
Rising demand in AI and automotive applications is accelerating 2.5D IC adoption, with multiple chiplets tightly placed to enable high-speed interconnects and heterogeneous integration. As chiplet counts grow, traditional placement tools,…
Vision Transformers (ViTs) have established new performance benchmarks in vision tasks such as image recognition and object detection. However, these advancements come with significant demands for memory and computational resources,…
Due to reduced manufacturing yields, traditional monolithic chips cannot keep up with the compute, memory, and communication demands of data-intensive applications, such as rapidly growing deep neural network (DNN) models. Chiplet-based…
As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), the resulting complexity and manufacturing challenges continue…
In the wake of dwindling Moore's Law, to address the rapidly increasing complexity and cost of fabricating large-scale, monolithic systems-on-chip (SoCs), the industry has adopted dis-aggregation as a solution, wherein a large monolithic…
Fast-evolving artificial intelligence (AI) algorithms such as large language models have been driving the ever-increasing computing demands in today's data centers. Heterogeneous computing with domain-specific architectures (DSAs) brings…
Chiplets are modular integrated circuits that can be combined to form a larger system, offering flexibility and performance enhancements. However, their dense packing often leads to significant thermal management challenges, requiring…
The exponential growth of AI has created unprecedented demand for computational resources, pushing chip designs to the limit while simultaneously escalating the environmental footprint of computing. As the industry transitions toward…