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The possibility of using Infrared Lock-In Thermography (LIT) to estimate the thickness of a sample was assessed and shown to be accurate up to 1.8mm. LIT is a technique involving heating samples with halogen lamps with varying intensity…
The plastic deformation processes that occur in a tensily deformed High Density Polyethylene specimen were studied from full-field strain and strain rate measurements obtained by 3D DIC (Digital Image Correlation).The tensile tests were…
A series of sigma-phase Fe_{100-x}V_x samples with 34.4 < x < 59.0 were investigated by neutron and X-ray diffraction and Mossbauer spectroscopy (MS) techniques. The first two methods were used for verification of the transformation from…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…
For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor…
Ultrafast diffraction is the cutting-edge technique to extract the atomic temperature at femtosecond timescales, and further related quantities - in particular, electron-phonon coupling strength at elevated electronic temperatures. The…
Fitting oscillator models to variable-angle spectroscopic ellipsometry (VASE) data can lead to non-unique, unphysical results. We demonstrate using temperature-dependent trends to prevent overfitting and ensure model physicality. As a case…
We explore the band dependence of the inferred X-ray temperature of the intracluster medium (ICM) for 192 well-observed galaxy clusters selected from the Chandra Data Archive. If the hot ICM is nearly isothermal in the projected region of…
We report a combined experimental and computational study of the optical properties of individual silicon telluride (Si2Te3) nanoplates. The p-type semiconductor Si2Te3 has a unique layered crystal structure with hexagonal closed-packed Te…
We present 50-fs, single-shot measurements of the x-ray thermal diffuse scattering (TDS) from copper foils that have been shocked via nanosecond laser-ablation up to pressures above 135~GPa. We hence deduce the x-ray Debye-Waller (DW)…
Understanding broadband photoconductive behaviour in two dimensional layered materials are important in order to utilize them for a variety of opto-electronic applications. Here we present our results of photocurrent spectroscopy…
We report measurements of the resistance of silicon MOSFETs as a function of temperature in high parallel magnetic fields where the 2D system of electrons has been shown to be fully spin-polarized. A magnetic field suppresses the metallic…
Hardware assurance of electronics is a challenging task and is of great interest to the government and the electronics industry. Physical inspection-based methods such as reverse engineering (RE) and Trojan scanning (TS) play an important…
3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with…
Thermal aware routing and placement algorithms are important in industry. Currently, there are reasonably fast Green's function based algorithms that calculate the temperature distribution in a chip made from a stack of different materials.…
The temperature of the working environment is a key factor in determining the properties of semiconductor detectors, and it affects the absolute accuracy and stability of the standard detector. In order to determine the temperature…
The effect of substrate thickness and its Debye temperature on the bolometric response of the freestanding-membrane type of superconductor transition-edge detectors is investigated. The investigation is based on the calculation of the…
Future complementary metal oxide semiconductor (CMOS) scaling for advanced integrated circuit (IC) technologies may well depend on "More than Moore" (MtM) approaches using heterogeneous integration of semiconductor-based devices. In order…
The temperature-dependent photoluminescence of perovskite quantum dots (CsPbBr3) in the visible band, is analyzed to evaluate their suitability for use in thermometry. A differential measurement of the photoluminescence can be used to…
This study investigates the temperature-induced hysteretic behavior of resistivity and magnetoresistance in electrodeposited bismuth films, with a focus on their application as absorbers in transition-edge sensors (TESs) for X-ray…