Related papers: An Analog Signal Processing EIC-PIC Solution for C…
Neuromorphic systems typically employ current-mode circuits that model neural dynamics and produce output currents that range from few pico-Amperes to hundreds of micro-Amperes. On-line real-time monitoring of the signals produced by these…
In this paper, we present a novel reconfigurable intelligent surface (RIS)-assisted integrated sensing and communication (ISAC) system with 1-bit quantization at the ISAC base station. An RIS is introduced in the ISAC system to mitigate the…
We have developed two radiation-hard ASICs for optical data transmission in the ATLAS pixel detector at the LHC at CERN: a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode for 80 Mbit/s data transmission from the…
Photonics has been one of the primary beneficiaries of advanced silicon manufacturing. By leveraging on mature complementary metal-oxide-semiconductor (CMOS) process nodes, unprecedented device uniformities and scalability have been…
Conventional analog-to-digital converters (ADCs) fail to capture high-dynamic-range (HDR) signals due to clipping. Modulo ADCs circumvent this limitation by folding the input prior to quantization and algorithmically reconstructing the…
This work presents techniques which can allow low-cost phased-array receivers to be reconfigured as interferometric imagers and thereby reducing cost. Since traditional phased arrays power combine incoming signals prior to digitization,…
Integrated sensing and communication (ISAC) will greatly enhance the efficiency of physical resource utilization. The design of ISAC signal based on the orthogonal frequency division multiplex (OFDM) signal is the mainstream. However, when…
Electronic and photonic chips revolutionized information technology through massive integration of functional elements, yet phonons as fundamental information carriers in solids remain underestimated. Here, we demonstrate large-scale…
Silicon photonic integrated circuit (PIC) builds on the demand for a low cost approach from established silicon-based manufacturing infrastructure traditionally built for electronics. Besides its natural abundance, silicon has desirable…
Integrated photonics provides a route both to miniaturize quantum key distribution (QKD) devices and to enhance their performance. A key element for achieving discrete-variable QKD is a single-photon detector. It is highly desirable to…
A new application-specific integrated circuit (ASIC), the high-speed charge-to-time converter (QTC) IWATSU CLC101, provides three channels, each consisting of preamplifier, discriminator, low-pass filter, and charge integration circuitry,…
Expanding far beyond traditional applications in optical interconnects at telecommunications wavelengths, the silicon nanophotonic integrated circuit platform has recently proven its merits for working with mid-infrared (mid-IR) optical…
Photonic integrated circuits (PICs) are attractive platforms to perform large-scale quantum information processing. While highly-functional PICs (e.g. silicon based photonic-circuits) and high-performance single photon sources (SPSs, e.g.…
Edge computing is a promising solution for handling high-dimensional, multispectral analog data from sensors and IoT devices for applications such as autonomous drones. However, edge devices' limited storage and computing resources make it…
Co-packaged optics (CPO) has emerged as a promising solution for achieving the ultra-high bandwidths, shoreline densities, and energy efficiencies required by future GPUs and network switches for AI. Microring modulators (MRMs) are well…
Low resolution analog-to-digital converters (ADCs) can be employed to improve the energy efficiency (EE) of a wireless receiver since the power consumption of each ADC is exponentially related to its sampling resolution and the hardware…
Modern lens designs are capable of resolving >10 gigapixels, while advances in camera frame-rate and hyperspectral imaging have made Terapixel/s data acquisition a real possibility. The main bottlenecks preventing such high data-rate…
We have designed three ASICs for possible applications in the optical links of a new layer of pixel detector in the ATLAS experiment for the first phase of the LHC luminosity upgrade. The ASICs include a high-speed driver for the VCSEL, a…
3D interconnects have emerged as a solution to address the scaling issues of interconnect bandwidth and the memory wall problem in high-performance computing (HPC), such as High-Bandwidth Memory (HBM). However, the copper-based electrical…
At least 25 kinds of detector-like devices need to be integrated in Phase I of the High Energy Photon Source (HEPS), and the work needs to be carefully planned to maximise productivity with highly limited human resources. After a systematic…