Related papers: Energy-efficient Non Uniform Last Level Caches for…

Current day processors employ multi-level cache hierarchy with one or two levels of private caches and a shared last-level cache (LLC). An efficient cache replacement policy at LLC is essential for reducing the off-chip memory transfer as…

Last level caches (LLCs) occupy a large chip-area and there size is expected to grow further to offset the limitations of memory bandwidth and speed. Due to high leakage consumption of SRAM device, caches designed with SRAM consume large…

Modern multicore processors are employing large last-level caches, for example Intel's E7-8800 processor uses 24MB L3 cache. Further, with each CMOS technology generation, leakage energy has been dramatically increasing and hence, leakage…

3D integration has the potential to improve the scalability and performance of Chip Multiprocessors (CMP). A closed form analytical solution for optimizing 3D CMP cache hierarchy is developed. It allows optimal partitioning of the cache…

Several emerging non-volatile (NV) memory technologies are rising as interesting alternatives to build the Last-Level Cache (LLC). Their advantages, compared to SRAM memory, are higher density and lower static power, but write operations…

Main memories play an important role in overall energy consumption of embedded systems. Using conventional memory technologies in future designs in nanoscale era causes a drastic increase in leakage power consumption and temperature-related…

The increasing density of transistors in Integrated Circuits (ICs) has enabled the development of highly integrated Systems-on-Chip (SoCs) and, more recently, Multiprocessor Systems-on-Chip (MPSoCs). To address scalability challenges in…

An effective way to improve energy efficiency is to throttle hardware resources to meet a certain performance target, specified as a QoS constraint, associated with all applications running on a multicore system. Prior art has proposed…

The Last Level Cache (LLC) is the processor's critical bridge between on-chip and off-chip memory levels - optimized for high density, high bandwidth, and low operation energy. To date, high-density (HD) SRAM has been the conventional…

With emerging storage-class memory (SCM) nearing commercialization, there is evidence that it will deliver the much-anticipated high density and access latencies within only a few factors of DRAM. Nevertheless, the latency-sensitive nature…

Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally…

The current workloads and applications are highly diversified, facing critical challenges such as the Power Wall and the Memory Wall Problem. Different strategies over the multiple levels of Caches have evolved to mitigate these problems.…

In this thesis, we describe a new, practical approach to integrating hardware-based data compression within the memory hierarchy, including on-chip caches, main memory, and both on-chip and off-chip interconnects. This new approach is fast,…

In modern server CPUs, the Last-Level Cache (LLC) serves not only as a victim cache for higher-level private caches but also as a buffer for low-latency DMA transfers between CPU cores and I/O devices through Direct Cache Access (DCA).…

As capacity and complexity of on-chip cache memory hierarchy increases, the service cost to the critical loads from Last Level Cache (LLC), which are frequently repeated, has become a major concern. The processor may stall for a…

Non-volatile memory (NVM) technologies are interesting alternatives for building the on-chip Last-Level Cache (LLC). Their advantages, compared to SRAM memory, are higher density and lower static power, but each write operation slightly…

Over the last three decades, innovations in the memory subsystem were primarily targeted at overcoming the data movement bottleneck. In this paper, we focus on a specific market trend in memory technology: 3D-stacked memory and caches. We…

General trends in computer architecture are shifting more towards parallelism. Multicore architectures have proven to be a major step in processor evolution. With the advancement in multicore architecture, researchers are focusing on…

Parallel programming is emerging fast and intensive applications need more resources, so there is a huge demand for on-chip multiprocessors. Accessing L1 caches beside the cores are the fastest after registers but the size of private caches…

High Performance and Energy Efficiency are critical requirements for Internet of Things (IoT) end-nodes. Exploiting tightly-coupled clusters of programmable processors (CMPs) has recently emerged as a suitable solution to address this…