Related papers: Evaluating System Identification Methods for Predi…
The management of the energy consumption and thermal dissipation of multi-core heterogeneous platforms is becoming increasingly important as it can have direct impact on the platform performance. This paper discusses an approach that…
Temperature control is a complex task due to its often unknown dynamics and disturbances. This paper explores the use of Neural Nonlinear AutoRegressive eXogenous (NNARX) models for nonlinear system identification and model predictive…
Multi-Processor Systems-on-Chip (MPSoC) can deliver high performance needed in many industrial domains, including aerospace. However, their high power consumption, combined with avionics safety standards, brings new thermal management…
Accurate knowledge of temperatures in power semiconductor modules is crucial for proper thermal management of such devices. Precise prediction of temperatures allows to operate the system at the physical limit of the device avoiding…
Recent embedded systems are designed with high-performance System-on-Chips (SoCs) to satisfy the computational needs of complex applications widely used in real life, such as airplane controllers, autonomous driving automobiles, medical…
We report a model-based method for quantifying heat flow and storage in thermal systems using data from multiple thermal sensors. This approach avoids stringent requirements on the system geometry and sensor positions and enables…
Power and thermal management are critical components of High-Performance-Computing (HPC) systems, due to their high power density and large total power consumption. The assessment of thermal dissipation by means of compact models directly…
Structural system identification in the presence of thermal loads is challenging, as unmeasured or poorly modeled thermal effects can mask or mimic damage, leading to unreliable conclusions. This work presents an optimization-driven,…
Standard (black-box) regression models may not necessarily suffice for accurate identification and prediction of thermal dynamics in buildings. This is particularly apparent when either the flow rate or the inlet temperature of the thermal…
In this paper the methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the infrared radiation will be introduced. With the proposed…
This study presents fast and accurate analytical methods for transient thermal modeling in multi-layer composites with an arbitrary number of layers. The proposed approach accounts for internal heat generation and non-homogeneities in the…
Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in order to make use of all the potential benefits of the vertical…
Optical Network-on-Chip (ONoC) is an emerging technology considered as one of the key solutions for future generation on-chip interconnects. However, silicon photonic devices in ONoC are highly sensitive to temperature variation, which…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
System identification uses measurements of a dynamic system's input and output to reconstruct a mathematical model for that system. These can be mechanical, electrical, physiological, among others. Since most of the systems around us…
Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction models can perform real-time prediction for many…
Virtually all electronic systems try to optimize a fundamental trade-off between higher performance and lower power consumption. The latter becomes critical in mobile computing systems, such as smartphones, which rely on passive cooling.…
By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower…
A machine-learning non-contact method to determine the temperature of a laser gain medium via its laser emission with a trained few-layer neural net model is presented. The training of the feed-forward Neural Network (NN) enables the…
Dynamic resource management has become one of the major areas of research in modern computer and communication system design due to lower power consumption and higher performance demands. The number of integrated cores, level of…