Related papers: Extending Memory Capacity in Consumer Devices with…
Non-volatile memory (NVM) technologies such as PCM, ReRAM and STT-RAM allow processors to directly write values to persistent storage at speeds that are significantly faster than previous durable media such as hard drives or SSDs. Many…
Die-stacked DRAM is a promising solution for satisfying the ever-increasing memory bandwidth requirements of multi-core processors. Manufacturing technology has enabled stacking several gigabytes of DRAM modules on the active die, thereby…
Compute-in-memory (PIM) mitigates the memory wall by performing computation within memory, reducing data movement and improving energy efficiency. DRAM-based PIM is particularly attractive due to its high density, mature manufacturing…
In order to meet the needs of high performance computing (HPC) in terms of large memory, high throughput and energy savings, the non-volatile memory (NVM) has been widely studied due to its salient features of high density, near-zero…
Neuromorphic hardware platforms can significantly lower the energy overhead of a machine learning inference task. We present a design-technology tradeoff analysis to implement such inference tasks on the processing elements (PEs) of a Non-…
Compute-in-memory (CiM) is a promising approach to alleviating the memory wall problem for domain-specific applications. Compared to current-domain CiM solutions, charge-domain CiM shows the opportunity for higher energy efficiency and…
Emergent nanoscale non-volatile memory technologies with high integration density offer a promising solution to overcome the scalability limitations of CMOS-based neural networks architectures, by efficiently exhibiting the key principle of…
The recent availability of fast, dense, byte-addressable non-volatile memory has led to increasing interest in the problem of designing and specifying durable data structures that can recover from system crashes. However, designing durable…
Commodity memory interfaces have difficulty in scaling memory capacity to meet the needs of modern multicore and big data systems. DRAM device density and maximum device count are constrained by technology, package, and signal in- tegrity…
3D die-stacked DRAM has emerged as a key technology for delivering high bandwidth and high density for applications such as high-performance computing, graphics, and machine learning. However, different applications place diverse and…
Superconductor electronics (SCE) is a promising complementary and beyond CMOS technology. However, despite its practical benefits, the realization of SCE logic faces a significant challenge due to the absence of dense and scalable…
Remote Direct Memory Access (RDMA) has been haunted by the need of pinning down memory regions. Pinning limits the memory utilization because it impedes on-demand paging and swapping. It also increases the initialization latency of large…
Write disturbance error (WDE) appears as a serious reliability problem preventing phase-change memory (PCM) from general commercialization, and therefore several studies have been proposed to mitigate WDEs. Verify-and-correction (VnC)…
The number of battery-powered devices is rapidly increasing due to the widespread use of IoT-enabled nodes in various fields. Energy harvesters, which help to power embedded devices, are a feasible alternative to replacing battery-powered…
Multiplexed Rank DIMMs (MRDIMMs) have recently emerged as memory devices that enable higher bandwidth without increasing DRAM chip frequencies. This paper presents a detailed performance, power and energy evaluation of a production server…
Ternary content addressable memory (TCAM) has been a critical component in caches, routers, etc., in which density, speed, power efficiency, and reliability are the major design targets. There have been the conventional low-write-power but…
The memory demands of large-scale deep neural networks (DNNs) require synaptic weight values to be stored and updated in off-chip memory like dynamic random-access memory, which reduces energy efficiency and increases training time.…
With the widespread use of Deep Neural Networks (DNNs), machine learning algorithms have evolved in two diverse directions -- one with ever-increasing connection density for better accuracy and the other with more compact sizing for energy…
Running neural networks (NNs) on microcontroller units (MCUs) is becoming increasingly important, but is very difficult due to the tiny SRAM size of MCU. Prior work proposes many algorithm-level techniques to reduce NN memory footprints,…
Recently, analog compute-in-memory (CIM) architectures based on emerging analog non-volatile memory (NVM) technologies have been explored for deep neural networks (DNN) to improve energy efficiency. Such architectures, however, leverage…