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Atmosphere modelling applications become increasingly memory-bound due to the inconsistent development rates between processor speeds and memory bandwidth. In this study, we mitigate memory bottlenecks and reduce the computational load of…
We show in this work that memory intensive computations can result in severe performance problems due to off-chip memory access and CPU-GPU context switch overheads in a wide range of deep learning models. For this problem, current…
Modern heterogeneous computing architectures, which couple multi-core CPUs with discrete many-core GPUs (or other specialized hardware accelerators), enable unprecedented peak performance and energy efficiency levels. Unfortunately, though,…
Data-centric distillation, including data augmentation, selection, and mixing, offers a promising path to creating smaller, more efficient student Large Language Models (LLMs) that retain strong reasoning abilities. However, there still…
The cores of main sequence intermediate- and high-mass stars are convective. Mixing at the radiative-convective boundary, waves excited by the convection, and magnetic fields generated by convective dynamos all influence the main sequence…
Recent advances in computing architectures and networking are bringing parallel computing systems to the masses so increasing the number of potential users of these kinds of systems. In particular, two important technological evolutions are…
Cyber-physical systems (CPS) integrate sensing, computing, communication and actuation capabilities to monitor and control operations in the physical environment. A key requirement of such systems is the need to provide predictable…
Efficient use of energy is essential for today's supercomputing systems, as energy cost is generally a major component of their operational cost. Research into "green computing" is needed to reduce the environmental impact of running these…
For manufacturing of aerospace composites, several parts may be processed simultaneously using convective heating in an autoclave. Due to uncertainties including tool placement, convective Boundary Conditions (BCs) vary in each run. As a…
Thermal analysis is increasingly critical in modern integrated circuits, where non-uniform power dissipation and high transistor densities can cause rapid temperature spikes and reliability concerns. Traditional methods, such as FEM-based…
In this paper we report on a novel simulation tool designed for the 3D coupled electro-thermal simulation of Smart Power Mosfets, that is a tool capable of taking into account not only the electrical (and thermal) behaviour of the power…
Modern real-time systems utilize considerable amounts of power while executing computation-intensive tasks. The execution of these tasks leads to significant power dissipation and heating of the device. It therefore results in severe…
Coreset, which is a summary of the original dataset in the form of a small weighted set in the same sample space, provides a promising approach to enable machine learning over distributed data. Although viewed as a proxy of the original…
Nowadays, data-intensive applications are gaining popularity and, together with this trend, processing-in-memory (PIM)-based systems are being given more attention and have become more relevant. This paper describes an analytical modeling…
Diffusion Transformers (DiTs) deliver remarkable image and video generation quality but incur high computational cost, limiting scalability and on-device deployment. We introduce CoReDiT, a structured token pruning framework for DiTs across…
In this paper is proposed a technique to integrate and simulate a dynamic memory in a multiprocessor framework based on C/C++/SystemC. Using host machine's memory management capabilities, dynamic data processing is supported without…
To accommodate the growing memory footprints of today's applications, CPU vendors have employed large DRAM caches, backed by large non-volatile memories like Intel Optane (e.g., Intel's Cascade Lake). The existing computer architecture…
Processing-in-Memory (PIM) has emerged as a promising computing paradigm to address the memory wall and the fundamental bottleneck of the von Neumann architecture by reducing costly data movement between memory and processing units. As with…
Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in order to make use of all the potential benefits of the vertical…
The increasing number of threads inside the cores of a multicore processor, and competitive access to the shared cache memory, become the main reasons for an increased number of competitive cache misses and performance decline. Inevitably,…