Related papers: The DAQ and control system for JadePix3

For the purpose of withstanding very high radiation doses, silicon pixel sensors with a 3D electrode geometry are being developed. Detectors of this kind are highly interesting for harch radiation environments such as expected in the High…

The CMS experiment at the LHC includes a hybrid silicon pixel detector for the reconstruction of charged tracks and of the interaction vertices. The detector is made of three barrel layers and two disks at each end of the barrel. Detector…

The CERN-RD50 CMOS working group develops the RD50-MPWseries of monolithic high-voltage CMOS pixel sensors for potential use in future high luminosity experiments such as the HL-LHC and FCC-hh. In this contribution, the design of the latest…

Nonlinear photonic chips have enabled the generation and processing of signals using only light, with performance far superior to that possible electronically - particularly with respect to speed. Although silicon-on-insulator has been the…

The upcoming High-Luminosity upgrade of the Large Hadron Collider (LHC) necessitates a complete replacement of the ATLAS Inner Detector with the new Inner Tracker (ITk). This upgrade imposes stringent requirements on the associated Detector…

Monolithic Active Pixel Sensors (MAPS) combine the sensing part and the front-end electronics in the same silicon layer, making use of CMOS technology. Profiting from the progresses of this commercial process, MAPS have been undergoing…

This technical report covers a set of experiments on the 64-core SPARC T3-4 system, comparing it to two similar AMD and Intel systems. Key characteristics as maximum integer and floating point arithmetic throughput are measured as well as…

An important component of EPICS (Experimental Physics and Industrial Control System) is iocCore, which is the core software in the IOC (input/output controller) front-end processors. At ICALEPCS 1999 a paper was presented describing plans…

Nonlinear photonic chips have succeeded in generating and processing signals all-optically with performance far superior to that possible electronically - particularly with respect to speed. Although silicon-on-insulator has been the…

We describe the two major components of CLEO III: the Silicon Vertex Detector and the Ring Imaging Cherenkov Detector (RICH). The Silicon Vertex Detector is a four layer barrel-style device which spans the radial distance from 2.5 cm to…

In this work we have developed a prototype gaseous pixel detector by combining a micromegas grid with a Timepix3 chip for the readout. The micromegas foil supported by a matrix of pillars about 50 $\mathrm{\mu m}$ high was manually placed…

Each accelerator control system has a variety of measurement devices. One of the most common types of instrument interfaces used for their control is a serial (RS-232) bus. It is inexpensive and adequate for relatively simple measurement…

Extracting and analyzing iris textures for biometric recognition has been extensively studied. As the transition of iris recognition from lab technology to nation-scale applications, most systems are facing high complexity in either time or…

The ATLAS pixel detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. With approximately 80 million readout channels, the ATLAS silicon pixel detector is a high-acceptance, high-resolution,…

Swift, high resolution CMOS pixel sensors are being developed for the ILC vertex detector, aiming to allow approaching the interaction point very closely. A major issue is the time resolution of the sensors needed to deal with the high…

Allpix$^2$ is a versatile, open-source simulation framework for silicon pixel detectors. Its goal is to ease the implementation of detailed simulations for both single sensors and more complex setups with multiple detectors. While…

This paper presents the characterisation and testing of the first wafer-scale monolithic stitched sensor (MOSS) prototype developed for the ALICE ITS3 upgrade that is to be installed during the LHC Long Shutdown 3 (2026-2030). The MOSS chip…

The ARCADIA INFN R&D project developed a Fully Depleted Monolithic Active Pixel Sensor (FD-MAPS) using a customized LFoundry 110 nm CIS process. The first in-beam characterization of the ARCADIA Main Demonstrator 3 (MD3) sensor with 200…

As the reliability of the robot's perception correlates with the number of integrated sensing modalities to tackle uncertainty, a practical solution to manage these sensors from different computers, operate them simultaneously, and maintain…

This paper introduces a high-performance Soft-Core Processor based data acquisition system designed for handling Resistive Plate Chambers (RPCs). The DAQ consist of FPGA-based hardware equipped with Soft-Core Processor and embedded…