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In this paper we evaluate the use of system identification methods to build a thermal prediction model of heterogeneous SoC platforms that can be used to quickly predict the temperature of different configurations without the need of…
Recent embedded systems are designed with high-performance System-on-Chips (SoCs) to satisfy the computational needs of complex applications widely used in real life, such as airplane controllers, autonomous driving automobiles, medical…
Virtually all electronic systems try to optimize a fundamental trade-off between higher performance and lower power consumption. The latter becomes critical in mobile computing systems, such as smartphones, which rely on passive cooling.…
State-of-the-art mobile processors can deliver fast response time and high throughput to maximize the user experience. However, high performance comes at the expense of larger power density, which leads to higher skin temperatures. Since…
We propose in this paper to study the energy-, thermal- and performance-aware resource management in heterogeneous datacenters. Witnessing the continuous development of heterogeneity in datacenters, we are confronted with their different…
The race towards performance increase and computing power has led to chips with heterogeneous and complex designs, integrating an ever-growing number of cores on the same monolithic chip or chiplet silicon die. Higher integration density,…
Energy-efficiency has become a major challenge in modern computer systems. To address this challenge, candidate systems increasingly integrate heterogeneous cores in order to satisfy diverse computation requirements by selecting cores with…
Modern multiprocessor system-on-chips (SoCs) integrate multiple heterogeneous cores to achieve high energy efficiency. The power consumption of each core contributes to an increase in the temperature across the chip floorplan. In turn,…
The rising use of deep learning and other big-data algorithms has led to an increasing demand for hardware platforms that are computationally powerful, yet energy-efficient. Due to the amount of data parallelism in these algorithms,…
Multi-Processor Systems-on-Chip (MPSoC) can deliver high performance needed in many industrial domains, including aerospace. However, their high power consumption, combined with avionics safety standards, brings new thermal management…
The increasing demands for computing performance have been a reality regardless of the requirements for smaller and more energy efficient devices. Throughout the years, the strategy adopted by industry was to increase the robustness of a…
Heterogeneous processors with architecturally different cores (CPU and GPU) integrated on the same die lead to new challenges and opportunities for thermal and power management techniques because of shared thermal/power budgets between…
Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in order to make use of all the potential benefits of the vertical…
Side channels remain a challenge to information flow control and security in modern computing platforms. Resource partitioning techniques that minimise the number of shared resources among processes are often used to address this challenge.…
In modern multi-core Mixed-Criticality (MC) systems, a rise in peak power consumption due to parallel execution of tasks with maximum frequency, specially in the overload situation, may lead to thermal issues, which may affect the…
Modern real-time systems utilize considerable amounts of power while executing computation-intensive tasks. The execution of these tasks leads to significant power dissipation and heating of the device. It therefore results in severe…
Heterogeneous computing systems provide high performance and energy efficiency. However, to optimally utilize such systems, solutions that distribute the work across host CPUs and accelerating devices are needed. In this paper, we present a…
This work proposes a methodology to find performance and energy trade-offs for parallel applications running on Heterogeneous Multi-Processing systems with a single instruction-set architecture. These offer flexibility in the form of…
The proliferation of heterogeneous chip multiprocessors in recent years has reached unprecedented levels. Traditional homogeneous platforms have shown fundamental limitations when it comes to enabling high-performance yet-ultra-low-power…
By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower…