Related papers: Thermal Stress Analysis of Liquid-Cooled 3D-ICs

Hot-spots are considered among the unavoidable consequences of the high integration density of 3D-ICs. Eliminating hot spots requires employing efficient cooling techniques. Using embedded channels, liquid cooling systems can be designed to…

Although 3D IC technology can provide very high integration density, they suffer from having hotspots that may reach thousands of degrees. To manage this heat, it is necessary to study the dynamics of cooling and thermal behavior of the…

3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…

In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…

By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower…

Thermal management of integrated circuits (ICs) is important to prevent thermal hotspots which are the leading cause of IC failure. Thermal management is even more critical in 3D integrated circuits (3D ICs) as the prevalence of thermal…

Cooling high-power electronics in multilayer integrated circuits (ICs) is challenging for existing cooling methods. In this work, we designed through-chip microchannels (TCMCs) that cross the entire chip perpendicularly to the layers, with…

For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor…

During electrostatic bonding, also known as anodic bonding, silicon is bonded to glass by applying an external voltage and simultaneous heating to temperatures of 200...450 $\deg$C. While cooling to working temperature after bonding…

3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with…

At ambient conditions, SiC is known to be resistant to irradiation with swift heavy ions (SHI) decelerating in the electronic stopping regime. However, there is no experimental data on the SiC irradiation at elevated temperatures. To…

Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in order to make use of all the potential benefits of the vertical…

Accurate on-chip temperature sensing is critical for the optimal performance of modern CMOS integrated circuits (ICs), to understand and monitor localized heating around the chip during operation. The development of quantum computers has…

Laser cooling of solids currently has a temperature floor of 50 - 100 K. We propose a method that could overcome this using defects, such as diamond color centers, with narrow electronic manifolds and bright optical transitions. It exploits…

Interconnect is one of the main performance determinant of modern integrated circuits (ICs). The new technology of vertical ICs places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to…

Digital image correlation (DIC) and crystal plasticity simulation were utilised to study cold dwell behaviour in a coarse grain Ti-6Al alloy at 3 different temperatures up to 230 C. Strains extracted from large volume grains were measured…

Modern multiprocessor system-on-chips (SoCs) integrate multiple heterogeneous cores to achieve high energy efficiency. The power consumption of each core contributes to an increase in the temperature across the chip floorplan. In turn,…

The question of whether static stress in fused silica relaxes at room temperature is still under debate. Here, we report experimental data investigating stress relaxation dynamics in fused silica at room temperature and up to 2 GPa stress…

Tricritical points separate continuous and discontinuous symmetry breaking transitions. They occur in a variety of physical systems and their mathematical models. A tricritical point is used to determine a liquid-solid phase transition line…

Virtual Data Center (VDC) embedding has drawn significant attention recently because of growing need for efficient and flexible means of Data Center (DC) resource allocation. Existing studies on VDC embedding mainly focus on improving DCs'…