Related papers: Thermal Analysis of a 3D Stacked High-Performance …
A three-dimensional model of a partially melted powder bed with particles stochastically distributed in size and space coordinates has been developed. Numerical simulation of temperature distributions in stainless steel AISI 316L and…
Abstract: Solid state sensors having timing capabilities are becoming an absolute need in particle tracking techniques of future experiments at colliders. In this sense, silicon sensors having 3D structure are becoming an interesting…
This article proposes a novel high-performance computing approach for the prediction of the temperature field in powder bed fusion (PBF) additive manufacturing processes. In contrast to many existing approaches to part-scale simulations,…
Thermal multi-phase flow simulations are indispensable to understanding the multi-scale and multi-physics phenomena in metal additive manufacturing (AM) processes, yet accurate and robust predictions remain challenging. This book chapter…
We theoretically consider temperature and density-dependent electron-phonon interaction induced many-body effects in the two-dimensional (2D) metallic carriers confined on the surface of the 3D topological insulator (e.g. Bi$_2$Se$_3$). We…
The continuous increase in computational power of GPUs, essential for advancements in areas like artificial intelligence and data processing, is driving the adoption of liquid cooling in data centers. Skived copper cold plates featuring…
Undoubtedly faster, larger and lower power per bit, but just how do you go about interfacing a DDR3 SDRAM DIMM to an FPGA? The DDR3 standard addresses the faster, more bandwidth and lower power per bit need, but it introduces new design…
Thermal management is vital for the efficient and safe operation of alkaline electrolysis systems. Traditional alkaline electrolysis systems use simple proportional-integral-differentiation (PID) controllers to maintain the stack…
Cryogenic semiconductor device models are essential in designing control systems for quantum devices and in benchmarking the benefits of cryogenic cooling for high-performance computing. In particular, the saturation of subthreshold swing…
Thermal analysis provides deeper insights into electronic chips behavior under different temperature scenarios and enables faster design exploration. However, obtaining detailed and accurate thermal profile on chip is very time-consuming…
Poor DRAM technology scaling over the course of many years has caused DRAM-based main memory to increasingly become a larger system bottleneck. A major reason for the bottleneck is that data stored within DRAM must be moved across a…
Magnetic reconnection has long been known to be the most important mechanism not only for mixing the plasmas by changing the magnetic field topology but also for releasing the magnetic field energy into the plasma kinetic energy. During…
This paper presents the design and implementation of TAPOR, a privacy-preserving, non-contact, and fully passive sensing system for accurate and robust 3D hand pose reconstruction for around-device interaction using a single low-cost…
The development and validation of 3D multiphase computational fluid dynamics (M-CFD) models and physics-informed data-driven modeling require data of high-quality and high-resolution. Considering the difficulties in acquiring the…
High temperature superconducting (HTS) stacks of coated conductors (CCs) can work as strong trapped field magnets (TFMs) and show potential in electrical applications. Pulsed field magnetization (PFM) is a practical method to magnetize such…
Heat transfer in semiconductor devices is dominated by chip and substrate assemblies, where heat generated within a finite chip layer dissipates into a semi-infinite substrate with much higher thermophysical properties. This mismatch…
Classical multi-scale methods involving two spatial scales face significant challenges when simulating heterogeneous structures with complicated three-scale spatial configurations. This study proposes an innovative higher-order three-scale…
Ultracold molecules, because of their rich internal structures and interactions, have been proposed as a promising platform for quantum science and precision measurement. Direct laser-cooling promises to be a rapid and efficient way to…
Wide-bandgap (WBG) semiconductors have promising applications in power electronics due to their high voltages, radio frequencies, and tolerant temperatures. Among all the WBG semiconductors, SiC has attracted attention because of its high…
In this article we propose and numerically implement a mathematical model for the simulation of three-dimensional semiconductor devices characterized by an heterogeneous material structure. The model consists of a system of nonlinearly…