Related papers: Temperature-Dependent Modeling of Thermoelectric E…
Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…
The designers pre-occupation to reduce energy consumption and to achieve better thermal ambience levels, has favoured the setting up of numerous building thermal dynamic simulation programs. The progress in the modelling of phenomenas and…
Data-driven modeling and control of temperature dynamics in mechatronics systems and industrial processes are challenging control engineering problems. This is mainly because the temperature dynamics is inherently infinite-dimensional,…
Particle beds are widely used in various systems and processes, such as particle heat exchangers, granular flow reactors, and additive manufacturing. Accurate modeling of thermal conductivity of particle beds and understanding of their heat…
Atomistic spin model simulations are immensely useful in determining temperature dependent magnetic prop- erties, but are known to give the incorrect dependence of the magnetization on temperature compared to exper- iment owing to their…
Thermal processes are one of the most common systems in the industry, making its understanding a mandatory skill for control engineers. So, multiple efforts are focused on developing low-cost and portable experimental training rigs…
The model-based control of building heating systems for energy saving encounters severe physical, mathematical and calibration difficulties in the numerous attempts that has been published until now. This topic is addressed here via a new…
The paper deals with an empirical validation of a building thermal model. We put the emphasis on sensitivity analysis and on research of inputs/residual correlation to improve our model. In this article, we apply a sensitivity analysis…
Warm forming processes have been successfully applied at laboratory level to overcome some important drawbacks of the Al-Mg alloys, such as poor formability and large springback. However, the numerical simulation of these processes requires…
As shown in our previous studies, geometrical field grading techniques such as stacked and protruding substrate designs cannot well mitigate high electric stress issue within power electronics modules. However, it was shown that a…
We explore the possibility to perform an in-situ transmission electron microscopy (TEM) thermoelectric characterization of materials. A differential heating element on a custom in-situ TEM microchip allows to generate a temperature gradient…
One of the ways natural and synthetic systems regulate temperature is via circulating fluids through vasculatures embedded within their bodies. Because of the flexibility and availability of proven fabrication techniques, vascular-based…
In-situ transmission electron microscopy (TEM) has become an important technique to study dynamic processes at highest spatial resolution and one branch is the investigation of phenomena related with electrical currents. Here, we present…
In this work we briefly present a thermomechanical model that could serve as starting point for industrial applications. We address the non-linearity due to temperature dependence of material properties and heterogeneity due to presence of…
The thermal sensitive electrical parameter (TSEP) method is crucial for enhancing the reliability of power devices through junction temperature monitoring. The TSEP method comprises three key processes: calibration, regression, and…
Significant progress has been made in the field of thermophotovoltaics, with efficiency recently rising to over 40% due to improvements in cell design and material quality, higher emitter temperatures, and better spectral management.…
The inter-temporal consumption flexibility of commercial buildings can be harnessed to improve the energy efficiency of buildings, or to provide ancillary service to the power grid. To do so, a predictive model of the building's thermal…
In this paper, a multilayer thermal infrared detector model has been achieved by finite element method (FEM). All contributions of the thermal conductance were taken into account and calculated. In order to maximize the detector response,…
Facing the thermal management challenges of Wide Bandgap (WBG) semiconductors, this study highlights the use of ARX parametric models, which provide accurate temperature predictions without requiring detailed understanding of component…
Thermal emission caused by the thermal motion of the charged particles is commonly broadband, un-polarized, and incoherent, like a melting pot of electromagnetic waves, which makes it unsuitable for infrared applications in many cases…