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Heat transfer in semiconductor devices is dominated by chip and substrate assemblies, where heat generated within a finite chip layer dissipates into a semi-infinite substrate with much higher thermophysical properties. This mismatch…

Machine Learning · Computer Science 2025-12-03 Wenhao Sha , Tienchong Chang

Emission of blackbody emission from the meltpool and surrounding area in laser powder bed fusion (LPBF) makes this process visible to a range of optical monitoring instruments intended for online process and quality control. Yet, these…

Optics · Physics 2025-02-13 Ryan W. Penny , A. John Hart

Numerous industrial thermal processes and fluid processes can be described by distributed parameter systems (DPSs), wherein many process parameters and variables vary in space and time. Early internal abnormalities in the DPS may develop…

Signal Processing · Electrical Eng. & Systems 2023-12-04 Peng Wei , Han-Xiong Li

In this paper we focus on analyzing the thermal modality of tactile sensing for material recognition using a large materials database. Many factors affect thermal recognition performance, including sensor noise, the initial temperatures of…

Robotics · Computer Science 2022-11-02 Haoping Bai , Haofeng Chen , Elizabeth Healy , Charles C. Kemp , Tapomayukh Bhattacharjee

Recently, there have been many works on the deep learning of statistical ensembles to determine the critical temperature of a possible phase transition. We analyze the detailed structure of an optimized deep learning machine and prove the…

Statistical Mechanics · Physics 2019-04-23 Ken-Ichi Aoki , Tatsuhiro Fujita , Tamao Kobayashi

This paper presents review points of mathematical modeling and system identification issues of heat flow process inside a closed box. For system parameter identification, the least squares method is employed and NI Temperature Box is used…

Dynamical Systems · Mathematics 2016-11-16 Sulaymon Eshkabilov , Elyor Madirimov

The thermal sensitive electrical parameter (TSEP) method is crucial for enhancing the reliability of power devices through junction temperature monitoring. The TSEP method comprises three key processes: calibration, regression, and…

Machine Learning · Computer Science 2025-01-10 Qinghao Zhang , Wenrui Li , Pinjia Zhang

As people spend up to 87% of their time indoors, intelligent Heating, Ventilation, and Air Conditioning (HVAC) systems in buildings are essential for maintaining occupant comfort and reducing energy consumption. These HVAC systems in smart…

Systems and Control · Electrical Eng. & Systems 2021-08-09 Shichao Xu , Yangyang Fu , Yixuan Wang , Zheng O'Neill , Qi Zhu

Materials with higher operating temperatures than today's state of the art can improve system performance in several applications and enable new technologies. Under most scenarios, a protective oxide scale with high melting temperatures and…

Materials Science · Physics 2020-07-27 Zachary D. McClure , Alejandro H. Strachan

Standard (black-box) regression models may not necessarily suffice for accurate identification and prediction of thermal dynamics in buildings. This is particularly apparent when either the flow rate or the inlet temperature of the thermal…

Systems and Control · Computer Science 2016-08-11 Georgios C. Chasparis , Thomas Natschlaeger

Thermal expansion in materials can be accurately modeled with careful anharmonic phonon calculations within density functional theory. However, because of interest in controlling thermal expansion and the time consumed evaluating thermal…

Materials Science · Physics 2017-11-03 Joseph T. Schick , Abhijith M. Gopakumar , Andrew M. Rappe

The eigenstate thermalization hypothesis provides a framework for understanding thermalization in isolated quantum many-body systems by characterizing statistical properties of local observables in energy eigenstates. Here we demonstrate…

Statistical Mechanics · Physics 2026-05-11 Pavel Orlov , Rustem Sharipov , Enej Ilievski

Optimal radiator thermal emission spectra maximizing thermophotovoltaic (TPV) conversion efficiency and output power density are determined when temperature effects in the cell are considered. To do this, a framework is designed in which a…

Computational Physics · Physics 2015-12-08 John DeSutter , Michael P. Bernardi , Mathieu Francoeur

We present a data-driven, differentiable neural network model designed to learn the temperature field, its gradient, and the cooling rate, while implicitly representing the melt pool boundary as a level set in laser powder bed fusion. The…

In context of laser powder bed fusion (L-PBF), it is known that the properties of the final fabricated product highly depend on the temperature distribution and its gradient over the manufacturing plate. In this paper, we propose a novel…

Artificial Intelligence · Computer Science 2023-01-31 Ashkan Mansouri Yarahmadi , Michael Breuß , Carsten Hartmann

Atomistic simulations provide insights into structure-property relations on an atomic size and length scale, that are complementary to the macroscopic observables that can be obtained from experiments. Quantitative predictions, however, are…

Materials Science · Physics 2021-04-14 Nataliya Lopanitsyna , Chiheb Ben Mahmoud , Michele Ceriotti

This paper presents a unified optimization framework for phase change material (PCM) based cooling systems. Thermal management is critical in applications such as photovoltaic (PV) modules, battery packs, and power electronics, where…

Systems and Control · Electrical Eng. & Systems 2026-04-20 Asmaou S. Ouedraogo , Donald J. Docimo

It is "conventional wisdom" that the uncertainty of local temperature measurements on equilibrium systems diverges exponentially fast as their temperature $T$ drops to zero. In contrast, some exactly solvable models showcase a more benign…

Quantum Physics · Physics 2018-07-04 Karen V. Hovhannisyan , Luis A. Correa

The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However,…

Hardware Architecture · Computer Science 2011-09-06 Annmol Cherian , Ajay Augustine , Jemy Jose , Vinod Pangracious

High-throughput computational and experimental design of materials aided by machine learning have become an increasingly important field in material science. This area of research has emerged in leaps and bounds in the thermal sciences, in…

Materials Science · Physics 2019-06-17 Hang Zhang , Kedar Hippalgaonkar , Tonio Buonassisi , Ole M. Løvvik , Espen Sagvolden , Ding Ding
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