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Related papers: In-situ study of creep in Sn-3Ag-0.5Cu solder

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Creep of directionally solidified Sn-3Ag-0.5Cu wt.% (SAC305) samples with near-<110> orientation along the loading direction and different microstructural lengthscale is investigated under constant load tensile testing and at a range of…

Applied Physics · Physics 2021-02-03 Tianhong Gu , Christopher M. Gourlay , T. Ben Britton

The heterogeneous evolution of microstructure in a single Cu/SAC305/Cu solder joint is investigated using in-situ thermal cycling combined with electron backscatter diffraction (EBSD). Local deformation due to thermal expansion mismatch…

Materials Science · Physics 2019-08-30 Tianhong Gu , Christopher M. Gourlay , T. Ben Britton

Samples of $\alpha$-SiC have been sintered with liquid phase (LPS) to 1950 $^\circ$C, in atmosphere of argon and processing times between 1 and 7 hours. Using scanning electron microscopy (SEM) the microstructure of the samples has been…

Understanding the creep mechanisms and deformation response at different stresses and temperatures is crucial for design using nickel-base superalloys for high-temperature applications. In this study, the creep behaviour of a newly designed…

Materials Science · Physics 2022-11-02 Jingwei Chen , Zifan Wang , Chrysanthi Papadaki , Alexander M. Korsunsky

To examine the microstructural evolution that occurs during transient creep, we deformed olivine aggregates to different strains that spanned the initial transient deformation. Two sets of samples with different initial grain sizes of 5…

Materials Science · Physics 2024-07-09 Harison S. Wiesman , Thomas Breithaupt , David Wallis , Lars N. Hansen

The mechanical properties of $\beta$-Sn single crystals have been systematically investigated using a combined methodology of micropillar tests and rate-dependent crystal plasticity modelling. The slip strength and rate sensitivity of…

The deformation behavior of single crystal and nanocrystalline nickel were studied using in situ micropillar compression experiments from quasi-static to high strain rates up to 10^3 s-1. Deformation occurred by dislocation slip activity in…

Materials Science · Physics 2025-04-28 Nidhin George Mathews , Matti Lindroos , Johann Michler , Gaurav Mohanty

Previous studies demonstrate that grain-boundary sliding could accelerate creep rate and give rise to large internal stresses that can lead to damage development, e.g. formation of wedge cracks. The present study provides more insight into…

Materials Science · Physics 2021-03-02 Markian Petkov , Elsiddig Elmukashfi , Edmund Tarleton , Alan C. F. Cocks

Advanced g-TiAl based intermetallics Mo-bearing have been developed to obtain the fine-grained microstructure required for superplastic deformation to be used during further processing. In the present work we have studied an alloy of…

Materials Science · Physics 2024-02-07 M. Castillo-Rodríguez , M. L. No , J. A. Jimenez , O. A. Ruano , J. San Juan

Here we analyze a three-dimensional distribution of crystallographic slip measured in-situ during the uniaxial deformation of hexagonal Ti-7Al. The slip field is reconstructed using a novel methodology that combines spatially resolved…

Materials Science · Physics 2021-04-27 Darren C. Pagan , Kelly E. Nygren , Matthew P. Miller

A systematic study of the compression creep properties of a single-crystalline Co-base superalloy (Co-9Al-7.5W-2Ta) was conducted at 950 {\deg}C, 975 {\deg}C and 1000 {\deg}C to reveal the influence of temperature and the resulting…

Crystal-level strain rate sensitivity and temperature sensitivity are investigated in Zircaloy-4 using combined of bending creep test, digital image correlation, electron backscatter detection and thermo-mechanical tensile tests with…

Materials Science · Physics 2021-09-14 Yang Liu , Weifeng Wan , Said El Chamaa , Mark R. Wenman , Catrin M. Davies , Fionn P. E. Dunne

The mechanical behavior of nanotwinned Cu was studied through indentation creep and constant strain rate indentation tests from 25 $^\circ$C to 200 $^\circ$C. The results showed an enhanced strain rate sensitivity of nanotwinned Cu with…

Materials Science · Physics 2018-06-04 L. W. Yang , C. Y. Wang , M. A. Monclús , L. Lu , J. M. Molina-Aldareguía , J. LLorca

A micromechanical model at the microscale within a crystal plasticity self-consistent model, is used to analyse loading histories in Type 316H stainless steel, common to structural components in high-temperature power plants. The study…

Materials Science · Physics 2021-03-02 Markian Petkov , Marc Chevalier , David Dean , Alan C. F. Cocks

We investigate the down-hill creep of a layer of granular material on a slope caused by an oscillatory variation of the size of the particles. The material is modeled as an athermal two dimensional polydisperse system of soft disks under…

Soft Condensed Matter · Physics 2022-08-31 E. A. Jagla

(Abridged, full abstract available in the text) The main goal of the study presented in this thesis was to perform in-situ investigations on deformation structures in plastically deformed polycrystalline copper at low degrees (<5%) of…

Materials Science · Physics 2009-09-29 Bo Jakobsen

The creep behaviour of a creep-resistant AE42 magnesium alloy reinforced with Saffil short fibres and SiC particulates in various combinations has been examined in the longitudinal direction, i.e., the plane containing random fibre…

Applied Physics · Physics 2017-05-02 A. K. Mondal , S. Kumar

Strain heterogeneity at the microstructural level plays a vital role in the deformation and fracture behaviour of dual or multi-phase materials. In the present work, the strain heterogeneity, localization and partitioning arising at the…

Co-base superalloys are considered as promising high temperature materials besides the well-established Ni-base superalloys. However, Ni appears to be an indispensable alloying element also in Co-base superalloys. To address the influence…

This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject…

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