Related papers: Analysis and Control of Power-Temperature Dynamics…
State-of-the-art mobile processors can deliver fast response time and high throughput to maximize the user experience. However, high performance comes at the expense of larger power density, which leads to higher skin temperatures. Since…
Modern multiprocessor system-on-chips (SoCs) integrate multiple heterogeneous cores to achieve high energy efficiency. The power consumption of each core contributes to an increase in the temperature across the chip floorplan. In turn,…
The race towards performance increase and computing power has led to chips with heterogeneous and complex designs, integrating an ever-growing number of cores on the same monolithic chip or chiplet silicon die. Higher integration density,…
In modern multi-core Mixed-Criticality (MC) systems, a rise in peak power consumption due to parallel execution of tasks with maximum frequency, specially in the overload situation, may lead to thermal issues, which may affect the…
This paper considers the problem of temperature regulation in multicore processors by dynamic voltage-frequency scaling. We propose a feedback law that is based on an integral controller with adjustable gain, designed for fast tracking…
The management of the energy consumption and thermal dissipation of multi-core heterogeneous platforms is becoming increasingly important as it can have direct impact on the platform performance. This paper discusses an approach that…
We study scheduling problems motivated by recently developed techniques for microprocessor thermal management at the operating systems level. The general scenario can be described as follows. The microprocessor's temperature is controlled…
As processor performance advances, increasing power densities and complex thermal behaviors threaten both energy efficiency and system reliability. This survey covers more than two decades of research on power and thermal modeling and…
Mixed-Criticality (MC) systems have recently been devised to address the requirements of real-time systems in industrial applications, where the system runs tasks with different criticality levels on a single platform. In some workloads, a…
Heterogeneous processors with architecturally different cores (CPU and GPU) integrated on the same die lead to new challenges and opportunities for thermal and power management techniques because of shared thermal/power budgets between…
Modern CPUs with increasing core frequency and power are rapidly reaching a point where the CPU frequency and performance are limited by the amount of heat that can be extracted by the cooling technology. In mobile environment, this issue…
Vision processing on traditional architectures is inefficient due to energy-expensive off-chip data movement. Many researchers advocate pushing processing close to the sensor to substantially reduce data movement. However, continuous…
Multi-Processor Systems-on-Chip (MPSoC) can deliver high performance needed in many industrial domains, including aerospace. However, their high power consumption, combined with avionics safety standards, brings new thermal management…
The consistent demand for better performance has lead to innovations at hardware and microarchitectural levels. 3D stacking of memory and logic dies delivers an order of magnitude improvement in available memory bandwidth. The price paid…
Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…
We propose in this paper to study the energy-, thermal- and performance-aware resource management in heterogeneous datacenters. Witnessing the continuous development of heterogeneity in datacenters, we are confronted with their different…
Modern real-time systems utilize considerable amounts of power while executing computation-intensive tasks. The execution of these tasks leads to significant power dissipation and heating of the device. It therefore results in severe…
Current methods to describe the thermodynamic behavior of many-particle systems are often based on perturbation theory with an unperturbed system consisting of free particles. Therefore, only a few methods are able to describe both strongly…
We introduce and experimentally validate a new macro-level model of the CPU temperature/power relationship within nanometer-scale application processors or system-on-chips. By adopting a holistic view, this model is able to take into…
Recent embedded systems are designed with high-performance System-on-Chips (SoCs) to satisfy the computational needs of complex applications widely used in real life, such as airplane controllers, autonomous driving automobiles, medical…