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Outsourcing in semiconductor industry opened up venues for faster and cost-effective chip manufacturing. However, this also introduced untrusted entities with malicious intent, to steal intellectual property (IP), overproduce the circuits,…

Over the years, many techniques have been introduced to protect integrated circuits (ICs) from hardware security threats that emerged in the globalized IC manufacturing supply chain, such as overproduction and piracy. However, most of these…

Intellectual property (IP) piracy has become a non-negligible problem as the integrated circuit (IC) production supply chain is becoming increasingly globalized and separated that enables attacks by potentially untrusted attackers. Logic…

Recent work on stealing machine learning (ML) models from inference engines with physical side-channel attacks warrant an urgent need for effective side-channel defenses. This work proposes the first $\textit{fully-masked}$ neural network…

Semiconductor design companies are integrating proprietary intellectual property (IP) blocks to build custom integrated circuits (IC) and fabricate them in a third-party foundry. Unauthorized IC copies cost these companies billions of…

The main goal of design obfuscation schemes is to protect sensitive design details from untrusted parties in the VLSI supply chain, including but not limited to off-shore foundries and untrusted end users. In this work, we provide a…

Physical adversarial attacks in object detection have attracted increasing attention. However, most previous works focus on hiding the objects from the detector by generating an individual adversarial patch, which only covers the planar…

Machine learning (ML) models can be trade secrets due to their development cost. Hence, they need protection against malicious forms of reverse engineering (e.g., in IP piracy). With a growing shift of ML to the edge devices, in part for…

Network-on-Chip (NoC) is widely used to facilitate communication between components in sophisticated System-on-Chip (SoC) designs. Security of the on-chip communication is crucial because exploiting any vulnerability in shared NoC would be…

Thermally aware design of 2.5D and 3D advanced packaging systems will require fast, accurate, and powerful thermal analysis of chiplets, stacks, and packages. These systems contain multiple materials with non-linear heat transfer properties…

To reduce the cost of ICs and to meet the market's demand, a considerable portion of manufacturing supply chain, including silicon fabrication, packaging and testing may be pushed offshore. Utilizing a global IC manufacturing supply chain,…

3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…

Federated Edge Learning (FEL) allows edge nodes to train a global deep learning model collaboratively for edge computing in the Industrial Internet of Things (IIoT), which significantly promotes the development of Industrial 4.0. However,…

Large Language Models (LLMs) are increasingly served on shared accelerators where an adversary with read access to device memory can observe KV caches and hidden states, threatening prompt privacy for open-source models. Cryptographic…

Microcontroller-based embedded systems are increasingly used for applications that can have serious and immediate consequences if compromised---including automobile control systems, smart locks, drones, and implantable medical devices. Due…

Security of embedded computing systems is becoming of paramount concern as these devices become more ubiquitous, contain personal information and are increasingly used for financial transactions. Security attacks targeting embedded systems…

The purpose of this paper is to fill a gap in the general understanding -- and academic scrutiny -- of current and emerging workflows for designing and fabricating integrated circuits. The approach is to compare the IC design workflow with…

There has been a significant increase in leakage energy dissipation of CMOS circuits with each technology generation. Further, due to their large size, last level caches (LLCs) spend a large fraction of their energy in the form of leakage…

With phenomenal growth of high speed and complex computing applications, the design of low power and high speed logic circuits have created tremendous interest. Conventional computing devices are based on irreversible logic and further…

Fully Homomorphic Encryption (FHE) allows computations to be performed directly on encrypted data without needing to decrypt it first. This "encryption-in-use" feature is crucial for securely outsourcing computations in privacy-sensitive…