Related papers: Temperature-Aware Virtual Data Center Embedding to…
Managing energy and thermal profiles is critical for many-core HPC processors with hundreds of application-class processing elements (PEs). Advanced model predictive control (MPC) delivers state-of-the-art performance but requires solving…
This paper presents a novel architecture for model predictive control (MPC) based indoor climate control of multi-zone buildings to provide energy efficiency. Unlike prior works we do not assume the availability of a high-resolution…
Cooling system plays a critical role in a modern data center (DC). Developing an optimal control policy for DC cooling system is a challenging task. The prevailing approaches often rely on approximating system models that are built upon the…
Thermoelectric coolers (TECs) offer a promising solution for direct cooling of local hotspots and active thermal management in advanced electronic systems. However, TECs present significant trade-offs among spatial cooling, heating and…
Dataset Condensation (DC) has emerged as a promising solution to mitigate the computational and storage burdens associated with training deep learning models. However, existing DC methods largely overlook the multi-domain nature of modern…
The increasing demand for Artificial Intelligence (AI) computing poses significant environmental challenges, with both operational and embodied carbon emissions becoming major contributors. This paper presents a carbon-aware holistic…
3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…
This report details the design and optimisation of a water-cooled forced convection heat dissipation system for use in high-temperature applications (ranges between 700 degrees - 1000 degrees K). A hollow cuboid vapour chamber model was…
In cloud infrastructure, accommodating multiple virtual networks on a single physical network reduces power consumed by physical resources and minimizes cost of operating cloud data centers. However, mapping multiple virtual network…
In this work we have proposed a geometric model that is employed to devise a scheme for identifying the hotspots and zones in a chip. These spots or zone need to be guarded thermally to ensure performance and reliability of the chip. The…
Main memories play an important role in overall energy consumption of embedded systems. Using conventional memory technologies in future designs in nanoscale era causes a drastic increase in leakage power consumption and temperature-related…
In this paper, we propose and study the effectiveness of customer engagement plans that clearly specify the amount of intervention in customer's load settings by the grid operator for peak load reduction. We suggest two different types of…
Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…
It is known that 3D-ICs suffer from hot spot temperatures that can reach thousands of degrees, if they are not cooled to reasonable operating temperatures. The problem of hot spots is not limited to the high temperatures of the IC; thermal…
Model predictive control (MPC) is a widely used technique for temperature set-point tracking and energy optimization of Heating Ventilation and Air Conditioning (HVAC) systems in buildings. Unfortunately, a nonlinear thermal building model…
The rising computational demand of modern workloads has renewed interest in energy-efficient paradigms such as neuromorphic and analog computing. A fundamental operation in these systems is matrix-vector multiplication (MVM), ubiquitous in…
Recently, embedding techniques have achieved impressive success in recommender systems. However, the embedding techniques are data demanding and suffer from the cold-start problem. Especially, for the cold-start item which only has limited…
In memory computing (IMC) architectures for deep learning (DL) accelerators leverage energy-efficient and highly parallel matrix vector multiplication (MVM) operations, implemented directly in memory arrays. Such IMC designs have been…
The ever-increasing need for power consumption in electronic devices, coupled with the requirement for thinner size, calls for the development of efficient heat spreading components. Vapor chambers (VCs), because of their ability to…
Main memory's rising energy consumption has emerged as a critical challenge in modern computing architectures, particularly in large-scale systems, driven by frequent access patterns, growing data volumes, and insufficient power management…