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Superconducting quantum circuits provide a versatile platform for studying quantum materials by leveraging precise microwave control and utilizing the tools of circuit quantum electrodynamics (QED). Hybrid circuit devices incorporating…

Mesoscale and Nanoscale Physics · Physics 2025-06-24 Sheng-Wen Huang , Ramya Suresh , Jian Liao , Botao Du , Zachary Miles , Leonid P. Rokhinson , Yong P. Chen , Ruichao Ma

Superconducting qubits, realized by incorporating Josephson junctions into superconducting circuits, behave as artificial atoms with anharmonic energy spectra and can be precisely controlled and measured using microwave cavities within the…

Quantum Physics · Physics 2026-05-04 Roson Nongthombam , Urmimala Dewan , Amarendra K. Sarma

Andreev (or superconducting) spin qubits (ASQs) have recently emerged as a promising qubit platform that combines superconducting circuits with semiconductor spin degrees of freedom. While recent experiments have successfully coupled two…

Quantum Physics · Physics 2025-01-14 Marta Pita-Vidal , Jaap J. Wesdorp , Christian Kraglund Andersen

Semiconductor qubits rely on the control of charge and spin degrees of freedom of electrons or holes confined in quantum dots (QDs). They constitute a promising approach to quantum information processing [1, 2], complementary to…

3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…

Other Computer Science · Computer Science 2008-12-18 Jürgen Wolf , P. Ramm , Armin Klumpp , H. Reichl

A promising way to store quantum information is by encoding it in the bosonic excitations of microwave resonators. This provides for long coherence times, low dephasing rates, as well as a hardware-efficient approach to quantum error…

Quantum Physics · Physics 2024-02-16 Lev Krayzman , Chan U Lei , Suhas Ganjam , James Teoh , Luigi Frunzio , Robert J. Schoelkopf

The demand for the three-dimensional (3D) integration of electronic components is on a steady rise. The through-silicon-via (TSV) technique emerges as the only viable method for integrating single-crystalline device components in a 3D…

The promise of quantum computation is contingent upon physical qubits with both low gate error rate and broad scalability. Silicon-based spins are a leading qubit platform, but demonstrations to date have not utilized fabrication processes…

Terahertz bands enable ultra-broadband wireless communications but require compact, low-cost, and efficient transceiver modules. Conventional implementations based on metallic waveguides or silicon lenses suffer from high loss, bulkiness,…

The performance of modular, networked quantum technologies will be strongly dependent upon the quality of their quantum light-matter interconnects. Solid-state colour centres, and in particular T centres in silicon, offer competitive…

Integrating 2D materials into circuit quantum electrodynamics (c-QED) devices is an emerging filed in recent years. This integration not only facilitates the exploration of potential applications in quantum information processing but also…

Quantum computing architectures are on the verge of scalability, a key requirement for the implementation of a universal quantum computer. The next stage in this quest is the realization of quantum error correction codes, which will…

Superconducting circuits are among the leading contenders for quantum information processing. This promising avenue has been strengthened with the advent of circuit quantum electrodynamics, underlined by recent experiments coupling on-chip…

Mesoscale and Nanoscale Physics · Physics 2009-03-24 Ferdinand Helmer , Matteo Mariantoni , Austin G. Fowler , Jan von Delft , Enrique Solano , Florian Marquardt

We present a scalable hybrid architecture for the 2D surface code combining superconducting resonators and hole-spin qubits in nanowires with tunable direct Rashba spin-orbit coupling. The back-bone of this architecture is a square lattice…

Quantum Physics · Physics 2017-04-12 Simon E. Nigg , Andreas Fuhrer , Daniel Loss

Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch through-silicon via (TSV) for advanced interconnections. The interconnection step can be done prior to or post CMOS…

Other Computer Science · Computer Science 2008-12-18 M. Puech , Jean-Marc Thevenoud , J. M. Gruffat , N. Launay , N. Arnal , P. Godinat

We present the fabrication and characterization of transmon qubits formed from aluminum Josephson junctions on two different silicon-based substrates: (i) high-resistivity silicon (Si) and (ii) silicon-on-insulator (SOI). Key to the qubit…

The key to realizing fault-tolerant quantum computation for singlet-triplet (ST) qubits in semiconductor double quantum dot (DQD) is to operate both the single- and two-qubit gates with high fidelity. The feasible way includes operating the…

Quantum Physics · Physics 2021-06-28 Wen-Xin Xie , Chengxian Zhang , Zheng-Yuan Xue

We present a superconducting qubit design that is fabricated in a 2D geometry over a superconducting ground plane to enhance the lifetime. The qubit is coupled to a microstrip resonator for readout. The circuit is fabricated on a silicon…

Despite mounting evidence that materials imperfections are a major obstacle to practical applications of superconducting qubits, connections between microscopic material properties and qubit coherence are poorly understood. Here, we perform…

The development of superconducting qubit technology has shown great potential for the construction of practical quantum computers. As the complexity of quantum processors continues to grow, the need for stringent fabrication tolerances…