Related papers: Robust BGA Void Detection Using Multi Directional …
The quality inspection of solder balls by detecting and measuring the void is important to improve the board yield issues in electronic circuits. In general, the inspection is carried out manually, based on 2D or 3D X-ray images. For high…
Printed circuit boards (PCBs) are essential components of electronic devices, and ensuring their quality is crucial in their production. However, the vast variety of components and PCBs manufactured by different companies makes it…
Quality control is a critical aspect of manufacturing, particularly in ensuring the proper assembly of small components in production lines. Existing solutions often rely on single-view imaging or manual inspection, which are prone to…
Quality control is of vital importance during electronics production. As the methods of producing electronic circuits improve, there is an increasing chance of solder defects during assembling the printed circuit board (PCB). Many…
Line segment detection plays a cornerstone role in computer vision tasks. Among numerous detection methods that have been recently proposed, the ones based on edge drawing attract increasing attention owing to their excellent detection…
The motor control board has various defects such as inconsistent color differences, incorrect plug-in positions, solder short circuits, and more. These defects directly affect the performance and stability of the motor control board,…
Motherboard defect detection is critical for ensuring reliability in high-volume electronics manufacturing. While prior research in PCB inspection has largely targeted bare-board or trace-level defects, assembly-level inspection of full…
A growing need exists for efficient and accurate methods for detecting defects in semiconductor materials and devices. These defects can have a detrimental impact on the efficiency of the manufacturing process, because they cause critical…
Semiconductor manufacturing is a complex, multistage process. Automated visual inspection of Scanning Electron Microscope (SEM) images is indispensable for minimizing equipment downtime and containing costs. Most previous research considers…
Detecting edges is a fundamental problem in computer vision with many applications, some involving very noisy images. While most edge detection methods are fast, they perform well only on relatively clean images. Indeed, edges in such…
Large-scale transmission radiography scanners are used to image vehicles and cargo containers. Acquired images are inspected for threats by a human operator or a computer algorithm. To make accurate detections, it is important that image…
The recent development of electric and electronic devices has been remarkable. The miniaturization of electronic devices and high integration are progressing by advances in mounting technology. As a result, the reliability of fatigue life…
Cosmic voids are biased tracers of the large-scale structure of the universe. Separate universe simulations (SUS) enable accurate measurements of this biasing relation by implementing the peak-background split (PBS). In this work, we apply…
In electronics manufacturing, solder joint defects are a common problem affecting a variety of printed circuit board components. To identify and correct solder joint defects, the solder joints on a circuit board are typically inspected…
In some scenarios, a single input image may not be enough to allow the object classification. In those cases, it is crucial to explore the complementary information extracted from images presenting the same object from multiple perspectives…
We study the prospects for measuring the dark matter distribution of voids with stacked weak lensing. We select voids from a large set of $N$-body simulations, and explore their lensing signals with the full ray-tracing simulations…
We present a deep learning system for testing graphics units by detecting novel visual corruptions in videos. Unlike previous work in which manual tagging was required to collect labeled training data, our weak supervision method is fully…
The adoption of 3D packaging technology necessitates the development of new approaches to failure electronic device analysis. To that end, our team is developing a tool called the quantum diamond microscope (QDM) that leverages an ensemble…
Understanding the interactions between microstructure, strain, phase, and material behavior is crucial in many scientific fields. However, quantifying these correlations is challenging, as it requires the use of multiple instruments and…
The growing demand for intelligent security in consumer electronics, such as smart home cameras and personal monitoring systems, is often hindered by the high computational cost and large model sizes of advanced AI. These limitations…