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As SRAM-based caches are hitting a scaling wall, manufacturers are integrating DRAM-based caches into system designs to continue increasing cache sizes. While DRAM caches can improve the performance of memory systems, existing DRAM cache…

We propose overcoming the memory capacity limitation of GPUs with high-capacity Storage-Class Memory (SCM) and DRAM cache. By significantly increasing the memory capacity with SCM, the GPU can capture a larger fraction of the memory…

Die-stacked DRAM is a promising solution for satisfying the ever-increasing memory bandwidth requirements of multi-core processors. Manufacturing technology has enabled stacking several gigabytes of DRAM modules on the active die, thereby…

This paper summarizes the idea of Tiered-Latency DRAM (TL-DRAM), which was published in HPCA 2013, and examines the work's significance and future potential. The capacity and cost-per-bit of DRAM have historically scaled to satisfy the…

Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally…

Processing-in-memory (PIM), as a novel computing paradigm, provides significant performance benefits from the aspect of effective data movement reduction. SRAM-based PIM has been demonstrated as one of the most promising candidates due to…

As a core component in modern data centers, key-value cache provides high-throughput and low-latency services for high-speed data processing. The effectiveness of a key-value cache relies on its ability of accommodating the needed data.…

Putting the DRAM on the same package with a processor enables several times higher memory bandwidth than conventional off-package DRAM. Yet, the latency of in-package DRAM is not appreciably lower than that of off-package DRAM. A promising…

Hybrid main memory systems combine both performance and capacity advantages from heterogeneous memory technologies. With larger capacities, higher associativities, and finer granularities, hybrid memory systems currently exhibit significant…

This paper investigates hardware-based memory compression designs to increase the memory bandwidth. When lines are compressible, the hardware can store multiple lines in a single memory location, and retrieve all these lines in a single…

The emergence of Phase-Change Memory (PCM) provides opportunities for directly connecting persistent memory to main memory bus. While PCM achieves high read throughput and low standby power, the critical concerns are its poor write…

Die-stacked DRAM caches are increasingly advocated to bridge the performance gap between on-chip Cache and main memory. It is essential to improve DRAM cache hit rate and lower cache hit latency simultaneously. Prior DRAM cache designs fall…

Modern workloads are demanding increasingly larger memory capacity. Compute Express Link (CXL)-based memory tiering has emerged as a promising solution for addressing this problem by utilizing traditional DRAM alongside slow-tier CXL memory…

In-memory caching systems are fundamental building blocks in cloud services. However, due to the coupled CPU and memory on monolithic servers, existing caching systems cannot elastically adjust resources in a resource-efficient and agile…

SSDs are emerging storage devices which unlike HDDs, do not have mechanical parts and therefore, have superior performance compared to HDDs. Due to the high cost of SSDs, entirely replacing HDDs with SSDs is not economically justified.…

In recent years, there is an increasing demand of big memory systems so to perform large scale data analytics. Since DRAM memories are expensive, some researchers are suggesting to use other memory systems such as non-volatile memory (NVM)…

Over the past two decades, the storage capacity and access bandwidth of main memory have improved tremendously, by 128x and 20x, respectively. These improvements are mainly due to the continuous technology scaling of DRAM (dynamic…

Caching is crucial for enabling high-throughput networks for data intensive applications. Traditional caching technology relies on DRAM, as it can transfer data at a high rate. However, DRAM capacity is subject to contention by most system…

Memories that exploit three-dimensional (3D)-stacking technology, which integrate memory and logic dies in a single stack, are becoming popular. These memories, such as Hybrid Memory Cube (HMC), utilize a network-on-chip (NoC) design for…

In Edge Computing (EC), containers have been increasingly used to deploy applications to provide mobile users services. Each container must run based on a container image file that exists locally. However, it has been conspicuously…