Related papers: Single shot ultrafast laser processing of high-asp…
Ultrafast lasers are ideal tools to process transparent materials because they spatially confine the deposition of laser energy within the material's bulk via nonlinear photoionization processes. Nonlinear propagation and filamentation were…
Ultrafast Bessel beams demonstrate a significant capacity of structuring transparent materials with high degree of accuracy and exceptional aspect ratio. The ability to localize energy on the nanometer scale (bypassing the 100 nm milestone)…
The ultimate feature size is key in ultrafast laser material processing. A capacity to signiicantly exceed optical limits and to structure below 100nm is essential to advance ultrafast processing into the field of metamaterials. Such…
A procedure and optical concept is introduced for ultrashort pulsed laser cleaving of transparent materials with tailored edges in a single pass. The procedure is based on holographically splitting a number of foci along the desired edge…
We report on the usage of ultrashort laser pulses in form of aberration-corrected Bessel-like beams for laser cutting of glass with bevels. Our approach foresees to incline the material's entrance surface with respect to the processing…
The separation of complex inner and outer contours of glass articles with curved surfaces using ultrashort pulsed lasers is reported. Single-pass, full-thickness modifications along the entire substrate are achieved using a processing…
The remarkable temporal properties of ultra-short pulsed lasers in combination with novel beam shaping concepts enable the development of completely new material processing strategies. We demonstrate the benefit of employing focus…
We report on the development of an ultrafast beam shaper capable of generating Bessel beams of high cone angle that maintain a high-intensity hot spot with subwavelength diameter over a propagation distance in excess of 8~mm. This generates…
One of the current trends of laser applications in material science is using high-intensity lasers to provide fast and efficient surface or volume modifications for achieving controllable material properties, synthesis of novel materials…
Ultrafast laser pulses spatially shaped as Bessel beams in dielectrics create high aspect ratio plasma channels whose relaxation can lead to the formation of nanochannels. We report a strong enhancement of the nanochannel drilling…
Advanced three-dimensional manufacturing techniques are triggering new paradigms in the way we design and produce sophisticated parts on demand. Yet, to fully unravel its potential, a few limitations have to be overcome, one of them being…
Semiconductor lasers with ultra-low thresholds and minimal footprints are a topic of active research. Such devices require a combination of high quality factor laser cavities with small active region volumes, which drives the quest for…
We report an ultrafast, parallel and beyond-the-master micro-patterning technique for ultrathin (30 nm-400 nm) non-absorbing polymer films by diffraction of a laser light through a two dimensional periodic aperture. The redistribution of…
Pushing the limits of precision and reproducibility in ultrafast laser-based nanostructuring requires detailed control over the properties of the illumination. Most traditional methods of laser-based manufacturing rely on the simplicity of…
Laser treatment has emerged into a cornerstone of industrial manufacturing. This creates the demand to understand in detail the involved physical processes and their dynamics, to control the process, and to keep guard in-situ the laser…
The industrial maturity of ultrashort pulsed lasers has triggered the development of a plethora of material processing strategies. Recently, the combination of these remarkable temporal pulse properties with advanced structured light…
Selective thin-film removal is needed in many microfabrication processes such as 3-D patterning of optoelectronic devices and localized repairing of integrated circuits. Various wet or dry etching methods are available, but laser machining…
Laser cutting of semiconductor wafers and transparent dielectrics has become a dominant process in manufacturing industries, encompassing a wide range of applications from flat display panels to microelectronic chips. Limited by the…
Ultrashort (femtosecond, fs) laser pulses have fascinating properties as they allow to confine optical energy on extreme scales in space and time. Such fs-laser pulsed beams can be seen as spatially thin slices of intense light that are…
We investigate the use of ultrafast lasers exposure to induce localized crystallization and elemental redistribution in amorphous dielectric multi-layers, composed of alternating Si3N4and SiO2layers of sub-micron thickness. Specifically,we…