Related papers: The STAR MAPS-based PiXeL detector
We report first STAR measurement on two heavy-flavor particle correlations in p+p collisions at RHIC. Heavy-flavor (charm and bottom) events are identified and separated on a statistical basis by the azimuthal correlation of their decay…
In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. Because of its radiation hardness and cost effectiveness, the n-on-p silicon…
Monolithic active pixel sensors (MAPS) are now well established as a technology for tracking charged particles, especially when low material budget is desirable. For such applications, sensors focus on spatial resolution and pixels with…
The CERN proposed $e^+e^-$ Future Circular Collider (FCC-ee) is an electroweak, flavour, Higgs and top factory with unprecedented luminosities. Many measurements at the FCC-ee will rely on precisely determining the particle production…
To cope with the harsh environment foreseen at the high luminosity conditions of HL- LHC, the ATLAS pixel detector has to be upgraded to be fully efficient with a good granularity, a maximized geometrical acceptance and an high read out…
The ALICE Collaboration is developing a novel vertexing detector to extend the heavy-flavour physics programme of the experiment during Run 4 by improving the pointing resolution of the tracking, particularly at low transverse momentum. It…
Mu3e is a novel experiment searching for charged lepton flavor violation in the rare decay $\mu^+ \rightarrow e^+e^-e^+$. Decay vertex position, decay time and particle momenta have to be precisely measured in order to reject both…
We propose to build and operate a detector that, for the first time, will measure the process $pp\to\nu X$ at the LHC and search for feebly interacting particles (FIPs) in an unexplored domain. The TI18 tunnel has been identified as a…
The Pixel Luminosity Telescope is a silicon pixel detector dedicated to luminosity measurement at the CMS experiment at the LHC. It is located approximately 1.75 m from the interaction point and arranged into 16 "telescopes", with eight…
The ATLAS pixel detector consists of 1744 identical silicon pixel modules arranged in three barrel layers providing coverage for the central region, and three disk layers on either side of the primary interaction point providing coverage of…
This report reviews current trends in the R&D of semiconductor pixellated sensors for vertex tracking and radiation imaging. It identifies requirements of future HEP experiments at colliders, needed technological breakthroughs and…
To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are…
The Planetary Instrument for X-ray Lithochemistry (PIXL) is a micro-focus X-ray fluorescence spectrometer mounted on the robotic arm of NASA's Perseverance rover. PIXL will acquire high spatial resolution observations of rock and soil…
The silicon pixel detector of the ALICE experiment at LHC comprises the two innermost layers of the inner tracking system of the apparatus. It contains 1200 readout chips, each of them corresponding to a 8192 pixel matrix. The single chip…
Owing to their intrinsic (geometry dependent) radiation hardness, 3D pixel sensors are promising candidates for the innermost tracking layers of the forthcoming experiment upgrades at the Phase 2 High-Luminosity LHC (HL-LHC). To this…
Monolithic Active Pixel Sensors (MAPS) have been developed since the late 1990s based on silicon substrates with a thin epitaxial layer (thickness of 10-15 $\mu$m) in which charge is collected on an electrode, albeit by disordered and slow…
Pixel sensors in 3D technology equip the outer ends of the staves of the Insertable B Layer (IBL), the innermost layer of the ATLAS Pixel Detector, which was installed before the start of LHC Run 2 in 2015. 3D pixel sensors are expected to…
Active Pixel Sensor (APS) technology has shown promise for next-generation vertex detectors. This paper discusses the design and testing of two generations of APS chips. Both are arrays of 128 by 128 pixels, each 20 by 20 micro-m. Each…
A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$\mu$m. To solidify this concept, the…
The calibration process for the hybrid array pixel detector designed for High Energy Photon Source in China, we called HEPS-BPIX, is presented in this paper. Based on the threshold scanning, the relationship between energy and threshold is…