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Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally…

Over the last three decades, innovations in the memory subsystem were primarily targeted at overcoming the data movement bottleneck. In this paper, we focus on a specific market trend in memory technology: 3D-stacked memory and caches. We…

The increasing density of transistors in Integrated Circuits (ICs) has enabled the development of highly integrated Systems-on-Chip (SoCs) and, more recently, Multiprocessor Systems-on-Chip (MPSoCs). To address scalability challenges in…

The rising use of deep learning and other big-data algorithms has led to an increasing demand for hardware platforms that are computationally powerful, yet energy-efficient. Due to the amount of data parallelism in these algorithms,…

Main memories play an important role in overall energy consumption of embedded systems. Using conventional memory technologies in future designs in nanoscale era causes a drastic increase in leakage power consumption and temperature-related…

Memory latency, bandwidth, capacity, and energy increasingly limit performance. In this paper, we reconsider proposed system architectures that consist of huge (many-terabyte to petabyte scale) memories shared among large numbers of CPUs.…

With the widespread use of Deep Neural Networks (DNNs), machine learning algorithms have evolved in two diverse directions -- one with ever-increasing connection density for better accuracy and the other with more compact sizing for energy…

The conventional approach of moving data to the CPU for computation has become a significant performance bottleneck for emerging scale-out data-intensive applications due to their limited data reuse. At the same time, the advancement in 3D…

Data copy is a widely-used memory operation in many programs and operating system services. In conventional computers, data copy is often carried out by two separate read and write transactions that pass data back and forth between the DRAM…

Hyperdimensional computing (HDC) is an emerging computational framework that takes inspiration from attributes of neuronal circuits such as hyperdimensionality, fully distributed holographic representation, and (pseudo)randomness. When…

Heterogeneous 3D System-on-Chips (3D SoCs) are the most promising design paradigm to combine sensing and computing within a single chip. A special characteristic of communication networks in heterogeneous 3D SoCs is the varying latency and…

The implementation of Hyperdimensional Computing (HDC) on In-Memory Computing (IMC) architectures faces significant challenges due to the mismatch between highdimensional vectors and IMC array sizes, leading to inefficient memory…

To overcome the well-known memory bottleneck of AI chips, 3D stacked architectures that employ advanced packaging technology with high-density through-silicon vias (TSVs) pins have proven to be a promising solution. The 3D-stacked AI chip…

A three-dimensional (3D) Network-on-Chip (NoC) enables the design of high performance and low power many-core chips. Existing 3D NoCs are inadequate for meeting the ever-increasing performance requirements of many-core processors since they…

HPC applications pose high demands on I/O performance and storage capability. The emerging non-volatile memory (NVM) techniques offer low-latency, high bandwidth, and persistence for HPC applications. However, the existing I/O stack are…

Hardware accelerators have become a de-facto standard to achieve high performance on current supercomputers and there are indications that this trend will increase in the future. Modern accelerators feature high-bandwidth memory next to the…

In recent years, there is an increasing demand of big memory systems so to perform large scale data analytics. Since DRAM memories are expensive, some researchers are suggesting to use other memory systems such as non-volatile memory (NVM)…

With emerging storage-class memory (SCM) nearing commercialization, there is evidence that it will deliver the much-anticipated high density and access latencies within only a few factors of DRAM. Nevertheless, the latency-sensitive nature…

Network-on-Chips (NoCs) have been widely employed in the design of multiprocessor system-on-chips (MPSoCs) as a scalable communication solution. NoCs enable communications between on-chip Intellectual Property (IP) cores and allow those…

Matrix-accelerated stencil computation is a hot research topic, yet its application to three-dimensional (3D) high-order stencils and HPC remains underexplored. With the emergence of matrix units on multicore CPUs, we analyze matrix-based…