Related papers: The Effect of Temperature on Amdahl Law in 3D Mult…
This work analyses the effects of sequential-to-parallel synchronization and inter-core communication on multicore performance, speedup and scaling. A modification of Amdahl law is formulated, to reflect the finding that parallel speedup is…
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However,…
With the spread of multi- and many-core processors more and more typical task is to re-implement some source code written originally for a single processor to run on more than one cores. Since it is a serious investment, it is important to…
The paper explains why Amdahl's Law shall be interpreted specifically for distributed parallel systems and why it generated so many debates, discussions, and abuses. We set up a general model and list many of the terms affecting parallel…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
In this work I present a generalization of Amdahl's law on the limits of a parallel implementation with many processors. In particular I establish some mathematical relations involving the number of processors and the dimension of the…
The problem of learning parallel computer performance is investigated in the context of multicore processors. Given a fixed workload, the effect of varying system configuration on performance is sought. Conventionally, the performance…
The multiprocessor effect refers to the loss of computing cycles due to processing overhead. Amdahl's law and the Multiprocessing Factor (MPF) are two scaling models used in industry and academia for estimating multiprocessor capacity in…
The consistent demand for better performance has lead to innovations at hardware and microarchitectural levels. 3D stacking of memory and logic dies delivers an order of magnitude improvement in available memory bandwidth. The price paid…
Thermal density and hot spots limit three-dimensional (3D) implementation of massively-parallel SIMD processors and prohibit stacking DRAM dies above them. This study proposes replacing SIMD by an Associative Processor (AP). AP exhibits…
Virtually all electronic systems try to optimize a fundamental trade-off between higher performance and lower power consumption. The latter becomes critical in mobile computing systems, such as smartphones, which rely on passive cooling.…
The race towards performance increase and computing power has led to chips with heterogeneous and complex designs, integrating an ever-growing number of cores on the same monolithic chip or chiplet silicon die. Higher integration density,…
Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…
Heterogeneous processors with architecturally different cores (CPU and GPU) integrated on the same die lead to new challenges and opportunities for thermal and power management techniques because of shared thermal/power budgets between…
This paper reinterprets Amdahl's law in terms of execution time and applies this simple model to supercomputing. The systematic discussion results in practical formulas enabling to calculate expected running time using large number of…
With technology scaling, the size of cache systems in chip-multiprocessors (CMPs) has been dramatically increased to efficiently store and manipulate a large amount of data in future applications and decrease the gap between cores and…
After Amdahl's trailblazing work, many other authors proposed analytical speedup models but none have considered the limiting effect of the memory wall. These models exploited aspects such as problem-size variation, memory size,…
It is known that 3D-ICs suffer from hot spot temperatures that can reach thousands of degrees, if they are not cooled to reasonable operating temperatures. The problem of hot spots is not limited to the high temperatures of the IC; thermal…
The process of numerical thermalization in particle-in-cell (PIC) simulations has been studied extensively. It is analogous to Coulomb collisions in real plasmas, causing particle velocity distributions (VDFs) to evolve towards a Maxwellian…
We examine the effect of the thermal vacuum on the power spectrum of inflation by using the thermal field dynamics. We find that the thermal effect influences the CMB anisotropy at large length scale. After removing the divergence by using…