Related papers: First functionality tests of a 64 x 64 pixel DSSC …
Compressive sensing has been used to demonstrate scene reconstruction and source localization in a wide variety of devices. To date, optical compressive sensors have not been able to achieve significant volume reduction relative to…
Three generations of full-custom analog integrated circuits designed for low-power, high-speed sampling of Radio-Frequency (RF) transients in excess of the Nyquist minimum have been developed. These 0.25$\mu m$ CMOS devices are denoted the…
Cameras for imaging in short and mid-wave infrared spectra are significantly more expensive than their counterparts in visible imaging. As a result, high-resolution imaging in those spectrum remains beyond the reach of most consumers. Over…
Wearable photoacoustic imaging devices hold great promise for continuous health monitoring and point-of-care diagnostics. However, the large data volume generated by high-density transducer arrays presents a major challenge for realizing…
Field effect transistors embedded into a depleted silicon bulk (DEPFETs) can be used as the first amplifying element for the detection of small signal charges deposited in the bulk by ionizing particles, X-ray photons or visible light. Very…
We present results from the characterization and optimization of six Skipper CCDs for use in a prototype focal plane for the SOAR Integral Field Spectrograph (SIFS). We tested eight Skipper CCDs and selected six for SIFS based on…
The WFI (Wide Field Imager) instrument is planned to be one of two complementary focal plane cameras on ESA's next X-ray observatory Athena. It combines unprecedented survey power through its large field of view of 40 amin x 40 amin…
Electroencephalogram (EEG) data compression is necessary for wireless recording applications to reduce the amount of data that needs to be transmitted. In this paper, an asymmetrical sparse autoencoder with a discrete cosine transform (DCT)…
The Silicon-On-Insulator PIXel (SOIPIX) detector is a unique monolithic structure imaging device currently being by the SOIPIX group, led by the High Energy Accelerator Research Organization (KEK). Our detector team at the KEK Photon…
Accurate 3D imaging is essential for machines to map and interact with the physical world. While numerous 3D imaging technologies exist, each addressing niche applications with varying degrees of success, none have achieved the breadth of…
A double-layer silicon detector consisting of two 500micron-thick silicon PIN photodiodes with independent readouts was mounted in a vacuum chamber and tested with X-ray sources. The detector is sensitive from 1-30 keV with an effective…
Hyperspectral image classification demands spatially coherent predictions and precise boundary delineation. Yet prevailing superpixel-based methods face an inherent contradiction: clustering aggregates similar pixels into regions, but the…
We report the development of a continuous-wave and pulsed X-band electron spin resonance (ESR) spectrometer for the study of spins on ordered surfaces down to cryogenic temperatures. The spectrometer operates in ultra-high vacuum and…
Current, state-of-the-art CCDs are close to being able to deliver all key performance figures for future strategic X-ray missions except for the required frame rates. Our Stanford group is seeking to close this technology gap through a…
3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a…
At Argonne National Laboratory, we are developing hard X-ray (2 to 20 keV) Transition Edge Sensor (TES) arrays for beamline science. The significantly improved energy resolution provided by superconducting detectors compared to…
In this paper we discuss a method for nondestructive measurements of the longitudinal profile of sub-picosecond electron bunches for X-Ray Free Electron Lasers (XFELs). The method is based on the detection of the Coherent Synchrotron…
A systematic experimental study of the main challenges for silicon-pixel sensors at the European XFEL is presented. The high instantaneous density of X-rays and the high repetition rate of the XFEL pulses result in signal distortions due to…
Small-pitch 3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC pixel detector upgrades. Prototype 3D sensors with pixel sizes of 50$\times$50 and 25$\times$100 $\mu$m$^{2}$…
While design of high performance lenses and image sensors has long been the focus of camera development, the size, weight and power of image data processing components is currently the primary barrier to radical improvements in camera…