Related papers: The INFN-FBK Phase-2 R{\&}D Program
We have developed a silicon pixel detector to enhance the physics capabilities of the PHENIX experiment. This detector, consisting of two layers of sensors, will be installed around the beam pipe at the collision point and covers a…
During the ATLAS phase II upgrade, the tracking system of the ATLAS experiment will be replaced by an all-silicon detector called the inner tracker (ITK) with a pixel detector as the most inner part. The monitoring data of the new system…
DEPleted Field Effect Transistor (DEPFET) active pixel detectors combine a first amplification stage with a fully depleted sensor in one single device, resulting in a very good signal-to-noise ratio even for thin sensors. DEPFET pixels are…
During the Long Shutdown 2 of the LHC in 2018/2019, the ALICE experiment plans the installation of a novel Inner Tracking System. It will replace the current six layer detector system with a seven layer detector using Monolithic Active…
Silicon photonics is being extended from the near-infrared (near-IR) window of 1.3-1.5 {\mu}m for optical fiber communications to the mid-infrared (mid-IR) wavelength-band of 2 {\mu}m or longer for satisfying the increasing demands in many…
The CMS collaboration is building a new inner tracking pixel detector for the High-Luminosity LHC. Each pixel readout chip will be controlled with a single serial input stream at 160 Mbps and will send out data via four current mode logic…
CMOS Image Sensors are experiencing significant growth due to their capabilities to be integrated in smartphones with refined image quality. One of the major contributions to the growth of image sensors is the innovation brought about in…
The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase-II shutdown. A new silicon Inner Tracker (ITk) will contain five pixel layers equipped with new sensors and readout electronics capable to improve the…
Silicon detectors based on the HV-CMOS technology are being investigated as possible candidate for the outer layers of the ATLAS pixel detector for the High Luminosity LHC. In this framework the H35Demo ASIC has been produced in the 350 nm…
We present a conceptual design for a low-mass, all pixel vertex detector using the CMOS quadruple well INMAPS process, capable of working in the very high luminosities exceeding 10^36 /cm^2 /sec that can be expected at the next generation…
We present a readout chip prototype for future pixel detectors with timing capabilities. The prototype is intended for characterizing 4D pixel arrays with a pixel size of $100\times100~\mu \text{m}^2$, where the sensors are Low Gain…
Two far-forward experimental systems are currently taking data during Run 3 at the Large Hadron Collider (LHC): FASER + FASER$\nu$ and SND@LHC. They are sensitive to some classes of beyond-the-Standard Model (BSM) particles, muons and…
We are developing an imaging polarimeter by combining a fine-pixel CMOS image sensor with a coded aperture mask as part of the cipher project, aiming to achieve X-ray polarimetry in the energy range of…
In the context of the CERN EP R&D on monolithic sensors and the ALICE ITS3 upgrade, the Tower Partners Semiconductor Co (TPSCo) 65 nm process has been qualified for use in high energy physics, and adopted for the ALICE ITS3 upgrade. An…
We explore the application of heterodyne interferometry for a weak-field coherent detection scheme. The methods detailed here will be used in ALPS II, an experiment designed to search for weakly-interacting, sub-eV particles. For ALPS II to…
An essential design requirement of the ALPS-II experiment is the efficient detection of single photons with a very low instrumental background of 10 {\mu}Hz. In 2011 the ALPS collaboration started to set up a TES detector (Transition-Edge…
A MHz frame rate X-ray area detector (LPD - Large Pixel Detector) is under development by the Rutherford Appleton Laboratory for the European XFEL. The detector will have 1 million pixels and allows analogue storage of 512 images taken at…
The ALICE Collaboration will undertake a major upgrade of the detector apparatus during the second LHC Long Shutdown LS2 (2019-2020) in view of the Runs 3 and 4 (2021-2029). The objective of the upgrade is two-fold: i) an improvement of the…
The recent R&D focus on CMOS sensors with charge collection in a depleted zone has opened new perspectives for CMOS sensors as fast and radiation hard pixel devices. These sensors, labelled as depleted CMOS sensors (DMAPS), have already…
We have developed two radiation-hard ASICs for optical data transmission in the ATLAS pixel detector at the LHC at CERN: a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode for 80 Mbit/s data transmission from the…