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Related papers: SurfCuit: Surface Mounted Circuits on 3D Prints

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Additive manufacturing strives to combine any combination of materials into three dimensional functional structures and devices, ultimately opening up the possibility of 3D printed machines. It remains difficult to actuate such devices,…

Soft Condensed Matter · Physics 2020-09-01 Song-Chuan Zhao , Mariska Maas , Kaspar Jansen , Martin van Hecke

Advancements in fabrication methods have shaped new computing device technologies. Among these methods, depositing electrical contacts to the channel material is fundamental to device characterization. Novel layered and two-dimensional (2D)…

In this paper, we propose an end-to-end transcoding pipeline, to create 3D Gaussian splatting (3DGS) models from existing 3D plenoptic point cloud or mesh models, when the original multi-view images of the captured 3D object or scene are…

Image and Video Processing · Electrical Eng. & Systems 2026-05-21 Maja Krivokuća , Riad Bendouro , Neus Sabater

The significant optical and size benefits of using a curved focal surface for imaging systems have been well studied yet never brought to market for lack of a high-quality, mass-producible, curved image sensor. In this work we demonstrate…

We present a 3D-printing-based design to produce wire-guided liquid microfilms that can be used for versatile spectroscopic applications. We demonstrate the ability of our instrument to provide optically useful liquid microfilms with highly…

Chemical Physics · Physics 2025-07-04 Matthew J. Silverstein , Yasashri Ranathunga , Yuki Kobayashi

Real2Sim is becoming increasingly important with the rapid development of surgical artificial intelligence (AI) and autonomy. In this work, we propose a novel Real2Sim methodology, Instrument-Splatting, that leverages 3D Gaussian Splatting…

Computer Vision and Pattern Recognition · Computer Science 2025-03-18 Shuojue Yang , Zijian Wu , Mingxuan Hong , Qian Li , Daiyun Shen , Septimiu E. Salcudean , Yueming Jin

Off-the-shelf fused filament fabrication 3D printers are widely accessible and convenient, yet they exhibit quality loss at high speeds due to dynamic mis-synchronization between printhead motion and material extrusion systems, notably…

Systems and Control · Electrical Eng. & Systems 2026-01-01 Yufan Lin , Xavier Guidetti , Yannick Nagel , Efe C. Balta , John Lygeros

Three-dimensional (3D) printing of bioelectronics offers a versatile platform for fabricating personalized and structurally integrated electronic systems within biological scaffolds. Biodegradable electronics, which naturally dissolve after…

We analyze the design of a potential replacement technology for the commercial ferrite circulators that are ubiquitous in contemporary quantum superconducting microwave experiments. The lossless, lumped element design is capable of being…

Integrating 2D materials into circuit quantum electrodynamics (c-QED) devices is an emerging filed in recent years. This integration not only facilitates the exploration of potential applications in quantum information processing but also…

Real-time proprioception is a challenging problem for soft robots, which have almost infinite degrees-of-freedom in body deformation. When multiple actuators are used, it becomes more difficult as deformation can also occur on actuators…

Robotics · Computer Science 2020-12-24 Rob B. N. Scharff , Guoxin Fang , Yingjun Tian , Jun Wu , Jo M. P. Geraedts , Charlie C. L. Wang

Dynamic 3D Gaussian splatting (3DGS) extends static 3DGS to render dynamic scenes, enabling AR/VR applications with moving objects. However, implementing dynamic 3DGS on edge devices faces challenges: (1) Loading all Gaussian parameters…

In this paper, we present a patch-based representation of surfaces, PolyFit, which is obtained by fitting jet functions locally on surface patches. Such a representation can be learned efficiently in a supervised fashion from both analytic…

Computer Vision and Pattern Recognition · Computer Science 2026-01-09 Ruochen Chen , Thuy Tran , Shaifali Parashar

Nowadays, high-speed machining is usually used for production of hardened material parts with complex shapes such as dies and molds. In such parts, tool paths generated for bottom machining feature with the conventional parallel plane…

Other Computer Science · Computer Science 2013-07-05 Laurent Tapie , Bernardin Mawussi , Walter Rubio , Benoît Furet

Inherent properties of superconducting Bi2Sr2CaCu2O8+x films, such as the high superconducting transition temperature Tc, efficient Josephson coupling between neighboring CuO layers, and fast quasiparticle relaxation dynamics, make them a…

Computing the electric eddy currents in non-linear materials, such as superconductors, is \E{not straightforward}. The design of superconducting magnets and power applications needs electromagnetic computer modeling, being in many cases a…

Superconductivity · Physics 2017-06-02 Enric Pardo , Milan Kapolka

This article introduces an experimental emulation of a novel chunk-based flexible multi-DoF aerial 3D printing framework. The experimental demonstration of the overall autonomy focuses on precise motion planning and task allocation for a…

Robotics · Computer Science 2024-02-09 Marios-Nektarios Stamatopoulos , Avijit Banerjee , George Nikolakopoulos

Developing soft circuits from individual soft logic gates poses a unique challenge: with increasing numbers of logic gates, the design and implementation of circuits leads to inefficiencies due to mathematically unoptimized circuits and…

New additive manufacturing methods are needed to realize more complex soft robots. One example is soft fluidic robotics, which exploits fluidic power and stiffness gradients. Porous structures are an interesting type for this approach, as…

Robotics · Computer Science 2022-10-27 Nick Willemstein , Herman van der Kooij , Ali Sadeghi

We present a lithographic method for fabricating free-standing microparticles directly from SUEX dry-film epoxy resist. Unlike conventional SU-8 particle fabrication, which requires patterning on solid substrates followed by…

Applied Physics · Physics 2026-03-20 Jason P. Beech , Jonas O. Tegenfeldt
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