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Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…

Emerging Technologies · Computer Science 2014-04-03 Mostafizur Rahman , Santosh Khasanvis , Jiajun Shi , Mingyu Li , Csaba Andras Moritz

Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…

Emerging Technologies · Computer Science 2016-05-02 Mingyu Li , Jiajun Shi , Mostafizur Rahman , Santosh Khasanvis , Sachin Bhat , Csaba Andras Moritz

Conventional 2D CMOS technology is reaching fundamental scaling limits, and interconnect bottleneck is dominating integrated circuit (IC) power and performance. While 3D IC technologies using Through Silicon Via or Monolithic Inter-layer…

Emerging Technologies · Computer Science 2016-05-09 Jiajun Shi , Mingyu Li , Santosh Khasanvis , Mostafizur Rahman , Csaba Andras Moritz

To continue scaling beyond 2-D CMOS with 3-D integration, any new 3-D IC technology has to be comparable or better than 2-D CMOS in terms of scalability, enhanced functionality, density, power, performance, cost, and reliability.…

Emerging Technologies · Computer Science 2017-11-13 Naveen Kumar Macha , Mostafizur Rahman

Integrated micro-nanochannel networks in fluidic devices are desirable in a number of applications ranging from self-healing/cooling materials to bioengineering. The conventional micro-manufacturing techniques are capable of either…

Materials Science · Physics 2017-04-10 Prasoon Kumar , Prasanna S Gandhi , Mainak Majumder

Unlocking the full potential of nanocrystals in electronic devices requires scalable and deterministic manufacturing techniques. A platform offering promising alternative paths to scalable production is microtomy, the technique of cutting…

Airbridges are essential for creating high-performance, low-parasitic interconnects in integrated circuits and quantum devices. Conventional multi-step fabrication methods hinder miniaturization and introduce process-related defects. We…

The development of superconducting qubit technology has shown great potential for the construction of practical quantum computers. As the complexity of quantum processors continues to grow, the need for stringent fabrication tolerances…

Integration of complex photonic structures onto optical fiber facets enables powerful platforms with unprecedented optical functionalities. Conventional nanofabrication technologies, however, do not permit viable integration of complex…

Controlled atomic scale fabrication of functional devices is one of the holy grails of nanotechnology. The most promising class of techniques that enable deterministic nanodevice fabrication are based on scanning probe patterning or surface…

Microfluidics is an established multidisciplinary research domain with widespread applications in the fields of medicine, biotechnology and engineering. Conventional production methods of microfluidic chips have been limited to planar…

Overcoming the limitations of current nanofabrication techniques to achieve nanoscale feature sizes is essential for achieving new regimes of light-matter interactions at extreme frequencies and length scales. Here, we demonstrate a…

Superconducting quantum interference devices (SQUIDs) are used for applications ranging from sensitive magnetometers to low-temperature electronics and quantum computation. We introduce a planar nano SQUID that was made with a single…

Applied Physics · Physics 2019-04-17 Itamar Holzman , Yachin Ivry

Photonic integrated circuits utilize various waveguide materials, each excelling in specific metrics like efficient light emission, low propagation loss, high electro-optic efficiency, and potential for mass production. Inherent…

In this article, we present a technology development of a superconducting qubit device 3D-integrated by flip-chip-bonding and processed following CMOS fabrication standards and contamination rules on 200 mm wafers. We present the utilized…

Hybrid circuit quantum electrodynamics (cQED) aims at coupling various quantum degrees of freedom, among which are spin and charge degrees of freedom in gate defined quantum dots, phonons or magnons... with quantized electromagnetic fields…

Superconducting nanowires undergoing quantum phase-slips have potential for impact in electronic devices, with a high-accuracy quantum current standard among a possible toolbox of novel components. A key element of developing such…

Superconductivity · Physics 2018-06-21 N. G. N. Constantino , M. S. Anwar , O. W. Kennedy , M. Dang , P. A. Warburton , J. C. Fenton

Scanning superconducting quantum interference device microscopy (sSQUID) is currently one of the most effective methods for direct and sensitive magnetic flux imaging on the mesoscopic scale. A SQUID-on-chip design allows integration of…

Mesoscale and Nanoscale Physics · Physics 2021-12-10 Y. P. Pan , J. J. Zhu , Y. Feng , Y. S. Lin , H. B. Wang , X. Y. Liu , H. Jin , Z. Wang , L. Chen , Y. H. Wang

A superconducting quantum interference device (SQUID) miniaturized into nanoscale is promising in the inductive detection of a single electron spin. A nano-SQUID with a strong spin coupling coefficient, a low flux noise, and a wide working…

Mesoscale and Nanoscale Physics · Physics 2016-12-28 Lei Chen , Hao Wang , Xiaoyu Liu , Long Wu , Zhen Wang

Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…

Hardware Architecture · Computer Science 2025-08-20 Yongxiang Liu , Yuchun Ma , Eren Kurshan , Glenn Reinman , Jason Cong
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