Related papers: Computation of thermal properties via 3D homogeniz…
In this paper we study the effective thermal behaviour of 3D representative volume elements (RVEs) of two-phased composite materials constituted by a matrix with cylindrical and spherical inclusions distributed randomly, with periodic…
In our previous papers we have described efficient and reliable methods of generation of representative volume elements (RVE) perfectly suitable for analysis of composite materials via stochastic homogenization. In this paper we profit from…
Real-world physical systems, like composite materials and porous media, exhibit complex heterogeneities and multiscale nature, posing significant computational challenges. Computational homogenization is useful for predicting macroscopic…
The increasing complexity of advanced materials with anisotropic thermal properties necessitates more generic and efficient methods to determine three-dimensional (3D) anisotropic thermal conductivity tensors with up to six independent…
Predicting effective thermal conductivity by solving a Partial Differential Equation (PDE) defined on a high-resolution Representative Volume Element (RVE) is a computationally intensive task. In this paper, we tackle the task by proposing…
An estimate of the effective toughness of heterogeneous materials is proposed based on the Phase Field Fracture model implemented in an FFT homogenization solver. The estimate is based on the simulation of the deformation of representative…
An uncoupled multi-scale homogenization approach is used to estimate the effective thermal conductivities of plain weave C/C composites with a high degree of porosity. The geometrical complexity of the material system on individual scales…
Heat transfer simulations of the fused filament fabrication process are an important tool to predict bonding, residual stresses and strength of 3D printed parts. But in order to capture the significant thermal gradients that occur in the…
Fused filament fabrication (FFF) is widely used to obtain polymer-based composites with improved mechanical and thermal conduction properties. The effective properties of the composites are sensitive to its structure including the shape,…
In this paper, a multilayer thermal infrared detector model has been achieved by finite element method (FEM). All contributions of the thermal conductance were taken into account and calculated. In order to maximize the detector response,…
A two-dimensional three-phase conducting composite with coated circular inclusions, periodically distributed in a parallelogram, is studied. The phases are assumed to be isotropic, and perfect contact conditions at the interfaces are…
The thermal conductivity of thin films is commonly estimated using the 3-omega experimental method. When calibrating the test setup, it is customary to use a specimen with a known thermal conductivity for validation. However, when…
Raman thermometry is advantageous for measuring the thermal transport of low-dimensional materials due to its non-contact nature. Transient Raman methods have improved the accuracy of steady-state Raman thermometry by removing the need for…
A coupled hygro-thermo-mechanical computational model is proposed for fibre reinforced polymers, formulated within the framework of Computational Homogenisation (CH). At each macrostructure Gauss point, constitutive matrices for thermal,…
We derive a new cross-property differential effective medium scheme for a composite material's thermal conductivity as a function of its electrical conductivity and vice versa. Our scheme assumes that one phase is embedded in the other as…
X-ray Thomson scattering (XRTS) constitutes an essential technique for diagnosing material properties under extreme conditions, such as high pressures and intense laser heating. Time-dependent density functional theory (TDDFT) is one of the…
Presented study concerns the possibility of evaluation of interfacial thermal resistance (ITR) between the constituents in composite materials with the use of flash technique. Two variants of such measurement are considered, the first of…
In this paper we report on a novel simulation tool designed for the 3D coupled electro-thermal simulation of Smart Power Mosfets, that is a tool capable of taking into account not only the electrical (and thermal) behaviour of the power…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…
Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in order to make use of all the potential benefits of the vertical…