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This paper introduces a novel curve-based slicing method for generating planar layers with dynamically varying orientations in digital light processing (DLP) 3D printing. Our approach effectively addresses key challenges in DLP printing,…
Layered manufacturing inherently suffers from staircase defects along surfaces that are gently slopped with respect to the build direction. Reducing the slice thickness improves the situation but never resolves it completely as flat layers…
Mechanical metamaterials owe their extraordinary properties and functionalities to their micro-/nanoscale design of which shape, including both geometry and topology, is perhaps the most important aspect. 4D printing enables programmed,…
The reproduction of automobile components through additive manufacturing presents significant geometric challenges, as many automotive parts feature complex, organically shaped surfaces that are difficult to fabricate accurately using…
Dielectrophoresis is an electric field-based technique for moving neutral particles through a fluid. When used for particle separation, dielectrophoresis has many advantages compared to other methods, providing label-free operation with…
Laser heating during additive manufacturing (AM) induces extreme and transient thermal conditions which critically influence the microstructure evolution and mechanical properties of the resulting component. However, accurately resolving…
Additive manufacturing strives to combine any combination of materials into three dimensional functional structures and devices, ultimately opening up the possibility of 3D printed machines. It remains difficult to actuate such devices,…
Additive manufacturing parameters of high-performance polymers greatly affect the thermal history and consequently quality of the end-part. For fused deposition modeling (FDM), this may include printing speed, filament size, nozzle, and…
Liquid jet impingement cooling is an efficient cooling technique where the liquid coolant is directly ejected from nozzles on the chip backside resulting in a high cooling efficiency due to the absence of the TIM and the lateral temperature…
Electrochemical 3D printing of conductors with microscale resolution holds a great promise for a wide range of applications, but the choice of suitable metals for these technologies remains limited. Most efforts so far have been focused on…
A powerful and flexible method of 3D nano-printing, based on focusing charged aerosol, has been developed. The self-consistent electric field configuration, created with a holey floating mask and used as the scaffold for printing…
In a powder bed fusion additive manufacturing (AM) process, the balling effect has a significant impact on the surface quality of the printing parts. Surface wetting helps the bonding between powder and substrate and the inter-particle…
3D printing has revolutionized the manufacturing of volumetric components and structures in many areas. Different technologies have been developed including light-induced techniques based on the photopolymerization of liquid resins. In…
Thermoelectric energy conversion is an attractive technology for generating electricity from waste heat and using electricity for solid-state cooling. However, conventional manufacturing processes for thermoelectric devices are costly and…
We established a production method of a good millimeter-wave absorber by using a 3D-printed mold. The mold has a periodic pyramid shape, and an absorptive material is filled into the mold. This shape reduces the surface reflection. The…
Future quantum technology relies crucially on building quantum networks with high fidelity. To achieve this challenging goal, it is of utmost importance to connect single quantum systems in a way such that their emitted single-photons…
We propose a highly feasible technique with no experimental overhead to rapidly cool the in-plane degrees of freedom of large two-dimensional ion crystals in Penning traps. Through simulations, we demonstrate that our approach enables the…
Vacuum-forming is a common manufacturing technique for constructing thin plastic shell products by pressing heated plastic sheets onto a mold using atmospheric pressure. Vacuum-forming is ubiquitous in packaging and casing products in…
Precision and chip contamination-free placement of two-dimensional (2D) materials is expected to accelerate both the study of fundamental properties and novel device functionality. Current transfer methods of 2D materials onto an arbitrary…
The state-of-the-art CMOS technology has started to adopt three-dimensional (3D) integration approaches, enabling continuous chip density increment and performance improvement, while alleviating difficulties encountered in traditional…