Related papers: A High-Performance Triple Patterning Layout Decomp…

As minimum feature size and pitch spacing further decrease, triple patterning lithography (TPL) is a possible 193nm extension along the paradigm of double patterning lithography (DPL). However, there is very little study on TPL layout…

For next-generation technology nodes, multiple patterning lithography (MPL) has emerged as a key solution, e.g., triple patterning lithography (TPL) for 14/11nm, and quadruple patterning lithography (QPL) for sub-10nm. In this paper, we…

As the feature size of semiconductor process further scales to sub-16nm technology node, triple patterning lithography (TPL) has been regarded one of the most promising lithography candidates. M1 and contact layers, which are usually…

Triple patterning lithography (TPL) is one of the most promising techniques in the 14nm logic node and beyond. However, traditional LELELE type TPL technology suffers from native conflict and overlapping problems. Recently LELEEC process…

Triple patterning lithography (TPL) is one of the most promising techniques in the 14nm logic node and beyond. Conventional LELELE type TPL technology suffers from native conflict and overlapping problems. Recently, as an alternative…

Triple patterning lithography (TPL) has been recognized as one of the most promising solutions to print critical features in advanced technology nodes. A critical challenge within TPL is the effective assignment of the layout to masks.…

Multiple patterning lithography has been widely adopted in advanced technology nodes of VLSI manufacturing. As a key step in the design flow, multiple patterning layout decomposition (MPLD) is critical to design closure. Due to the…

Multiple patterning lithography (MPL) is regarded as one of the most promising ways of overcoming the resolution limitations of conventional optical lithography due to the delay of next-generation lithography technology. As the feature size…

As the feature size of semiconductor technology shrinks to 10 nm and beyond, the multiple patterning lithography (MPL) attracts more attention from the industry. In this paper, we model the layout decomposition of MPL as a generalized graph…

The most direct definition of a patterning process' resolution is the smallest half-pitch feature it is capable of transferring onto the substrate. Here we demonstrate that thermal Scanning Probe Lithography (t-SPL) is capable of…

In this paper, we introduce the proper latent decomposition (PLD) as a generalization of the proper orthogonal decomposition (POD) on manifolds. PLD is a nonlinear reduced-order modeling technique for compressing high-dimensional data into…

With the aggressive scaling of VLSI technology, the explosion of layout patterns creates a critical bottleneck for DFM applications like OPC. Pattern clustering is essential to reduce data complexity, yet existing methods struggle with…

Achieving fast and continuous fabrication of large-scale complex 3D structures is key to unlocking industrial-scale adoption of two-photon lithography (TPL). Despite substantial improvement in peak optical patterning rates enabled by recent…

Multipatterning is an essential decomposition strategy in electronic design automation (EDA) that overcomes lithographic limitations when printing dense circuit layouts. Although heuristic-based backtracking and SAT solvers can address…

Pulsed-laser deposition (PLD) is one of the most promising techniques for the formation of complex-oxide heterostructures, superlattices, and well-controlled interfaces. The first part of this paper presents a review of several useful…

Self-aligned double patterning (SADP) has become a promising technique to push pattern resolution limit to sub-22nm technology node. Although SADP provides good overlay controllability, it encounters many challenges in physical design…

Graph-structured datasets often suffer from class imbalance, which complicates node classification tasks. In this work, we address this issue by first providing an upper bound on population risk for imbalanced transductive node…

We propose a novel sparse tensor decomposition method, namely Tensor Truncated Power (TTP) method, that incorporates variable selection into the estimation of decomposition components. The sparsity is achieved via an efficient truncation…

Recently, triple decomposition has attracted increasing attention for decomposing third-order tensors into three factor tensors. However, this approach is limited to third-order tensors and enforces uniformity in the lower dimensions across…

Thin films of functional inorganic materials, particularly oxides, play a vital role in optoelectronics, enabling applications that range from active optical components to MEMS-based architectures. Achieving high aspect ratio patterning of…