Related papers: Development of Single- and Double-sided Ladders fo…

Significant progress has been made to develop silicon pixel technologies for use in the vertex and tracker regions of the proposed Compact Linear Collider (CLIC) detector design. The electron-positron collisions generated by this linear…

A new module concept for future ATLAS pixel detector upgrades is presented, where thin n-in-p silicon sensors are connected to the front-end chip exploiting the novel Solid Liquid Interdiffusion technique (SLID) and the signals are read out…

The Belle II experiment at KEK in Japan considers upgrading its vertex detector system to address the challenges posed by high background levels caused by the increased luminosity of the SuperKEKB collider. One proposal for upgrading the…

The R&D activity presented is focused on the development of new modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The performance after irradiation of n-in-p pixel sensors of different active thicknesses…

Monolithic Active Pixel Sensors (MAPS) combine the sensing part and the front-end electronics in the same silicon layer, making use of CMOS technology. Profiting from the progresses of this commercial process, MAPS have been undergoing…

The CLIC Tracker Detector (CLICTD) is a monolithic pixel sensor featuring pixels of 30um x 37.5um and a small collection diode. The sensor is fabricated in a 180 nm CMOS imaging process, using two different pixel flavours: the first with a…

3D object detection is a key component of many robotic applications such as self-driving vehicles. While many approaches rely on expensive 3D sensors such as LiDAR to produce accurate 3D estimates, methods that exploit stereo cameras have…

The physics aims at the proposed future high-energy linear $e^+e^-$ collider CLIC pose challenging demands on the performance of the detector system. In particular, the vertex and tracking detectors have to combine a spatial resolution of a…

The ALICE collaboration is preparing an upgrade of the three innermost layers of the current Inner Tracking System (ITS) during the next LHC long shutdown (LS3). The new ITS detector will use wafer-scale (up to \SI{27}{cm} in length)…

The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer…

The upgrade of the Inner Tracking System (ITS) of ALICE (A Large Ion Collider Experiment) will extend measurements of heavy-flavour hadrons and low-mass dileptons to a lower transverse momentum than currently achieved and increase the…

CMOS pixel sensors (CPS) represent a novel technological approach to building charged particle detectors. CMOS processes allow to integrate a sensing volume and readout electronics in a single silicon die allowing to build sensors with a…

This paper presents the design and results of detailed tests of a CMOS active pixel chip for charged particle detection with in-pixel charge storage for correlated double sampling and readout in rolling shutter mode at frequencies up to 25…

During LHC Long Shutdown 3, the ALICE experiment will replace the three innermost layers of its Inner Tracking System (ITS2) with a new vertex detector, the ITS3. This new detector will be assembled using wafer-scale, stitched Monolithic…

The Multi-Chip-Module-Deposited (MCM-D) technique has been used to build hybrid pixel detector assemblies. This paper summarises the results of an analysis of data obtained in a test beam campaign at CERN. Here, single chip hybrids made of…

Pixel Detectors, as the current technology of choice for the innermost vertex detection, have reached a stage at which large detectors have been built for the LHC experiments and a new era of developments, both for hybrid and for monolithic…

The physics aims at the proposed future CLIC high-energy linear $e^+ e^-$ collider pose challenging demands on the performance of the detector system. In particular the vertex and tracking detectors have to combine precision measurements…

Recent work carried out in the SiD Consortium is reported. Results have been obtained with the Chronopix version 3 chip, intended for the SiD vertex detector. A test structure is being produced for KPiXM, a CMOS MAPS approach that could be…

CLICTD is a monolithic silicon pixel sensor fabricated in a modified 180 nm CMOS imaging process with a small collection electrode design and a high-resistivity epitaxial layer. It features an innovative sub-pixel segmentation scheme and is…

The status of the R&D on the Cylindrical-GEM (CGEM) detector foreseen as Inner Tracker for KLOE-2, the upgrade of the KLOE experiment at the DAFNE phi-factory, will be presented. The R&D includes several activities: i) the construction and…