Related papers: Further Developments in Gold-stud Bump Bonding
The interface properties between gold (Au) contacts and molybdenum disulfide (MoS2) are critical for optimizing the performance of semiconductor devices. This study investigates the impact of metal dopants (D) on the transport properties of…
We review the binding and energy level alignment of $\pi$-conjugated systems on metals, a field which during the last two decades has seen tremendous progress both in terms of experimental characterization as well as in the depth of…
We describe a technique for connecting a nanometer-scale gold grain to leads by atomic-scale gold point contacts. These devices differ from previous metallic quantum dots in that the conducting channels are relatively well-transmitting. We…
Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D phase, and in general for small-scale applications, such…
A supersolid is a counter-intuitive state of matter that combines the frictionless flow of a superfluid with the crystal-like periodic density modulation of a solid. Since the first prediction in the 1950s, experimental efforts to realize…
We present series of first-principles calculations for both pure and hydrogen contaminated gold wire systems in order to investigate how such impurities can be detected. We show how a single H atom or a single H2 molecule in an atomic gold…
We summarize the R&D activities on a novel semitransparent microstrip sensor to be used on laser-based alignment systems for silicon trackers. The new sensor is used both for particle tracking and laser detection. The aim of this research…
The life time of electronic circuits board are impacted by the voids present in soldering balls. The quality inspection of solder balls by detecting and measuring the void is important to improve the board yield issues in electronic…
We devise a scheme to characterize tunneling of an excess electron shared by a pair of tunnel-coupled dangling bonds on a silicon surface -- effectively a two-level system. Theoretical estimates show that the tunneling should be highly…
A central problem in the deployment of quantum technologies is the realization of robust architectures for quantum interconnects. We propose to engineer interconnects in semiconductors and insulators by patterning spin qubits at…
A weakly biased normal-metal-superconductor junction is considered as a potential device injecting entangled pairs of quasi-particles into a normal-metal lead. The two-particle states arise from Cooper pairs decaying into the normal lead…
The R&D Collaboration SiLC (Silicon tracking for Linear Colliders) is based on generic R&D aiming to develop the next generation of large Silicon tracking systems for the Linear collider experiments; it serves all three ILC detector…
We present an improved fabrication process for overlapping aluminum gate quantum dot devices on Si/SiGe heterostructures that incorporates low-temperature inter-gate oxidation, thermal annealing of gate oxide, on-chip electrostatic…
Pseudo-Goldstone bosons in 4D strongly coupled theories have a dual description in terms of 5D gauge theories in warped backgrounds. We introduce systematic methods of computing the pseudo-Goldstone potential for an arbitrary warp factor in…
The physics aims at the proposed high-energy $e^+e^-$ collider CLIC pose challenging demands on the performance of the detector system. Precise hit-time tagging, an excellent spatial resolutions, and a low mass are required for the vertex…
In order to expand the astrophysical reach of gravitational wave detectors, several interferometer topologies have been proposed to evade the thermodynamic and quantum mechanical limits in future detectors. In this work, we make a…
The existence of charged Higgs boson(s) is inevitable in models with two (or more) Higgs doublets. Hence, their discovery would constitute unambiguous evidence for new physics beyond the Standard Model (SM). Taking into account all relevant…
We present a fabrication process for fully superconducting interconnects compatible with superconducting qubit technology. These interconnects allow for the 3D integration of quantum circuits without introducing lossy amorphous dielectrics.…
High-gradient linacs of next generation require novel accelerating structures which are compact, robust and cost-effective. Dedicated research and development have been launched in the linear-collider community. This paper focuses on the…
Deep neural networks designed for vision tasks are often prone to failure when they encounter environmental conditions not covered by the training data. Single-modal strategies are insufficient when the sensor fails to acquire information…