Related papers: Further Developments in Gold-stud Bump Bonding
Large-scale quantum computers with more than $10^5$ qubits will likely be built within the next decade. Trapped ions, semiconductor devices, and superconducting qubits among other physical implementations are still confined in the realm of…
The isolated substitutional gold impurity in bulk silicon is studied in detail using electronic structure calculations based on density-functional theory. The defect system is found to be a non-spin-polarized negative-U centre, thus…
Crystal strain variation imposes significant limitations on many quantum sensing and information applications for solid-state defect qubits in diamond. Thus, precision measurement and control of diamond crystal strain is a key challenge.…
Sensing technology has been widely investigated and utilized for gas detection. Due to the different applicability and inherent limitations of different gas sensing technologies, researchers have been working on different scenarios with…
Two-dimensional single-crystal metals are highly sought after for next-generation technologies. Here, we report large-area (>10^4 {\mu}m2), single-crystal two-dimensional gold with thicknesses down to a single-nanometer level, employing an…
Using first principles density functional calculations, gold monatomic wires are found to exhibit a zigzag shape which remains under tension, becoming linear just before breaking. At room temperature they are found to spin, what explains…
Superconducting electrodes are an integral part of hybrid Josephson junctions used in many applications including quantum technologies. We report on the fabrication and characterization of superconducting hybrid Au/YBa2Cu3O7-x (YBCO)…
As interconnect dimensions continue to shrink, the industry-standard copper faces a critical increase in resistivity, presenting a significant hurdle to overall device performance. To overcome this limitation, this work investigates the…
Previously, the authors reported direct evidence of channel saturation and conductance quantization in atomic-sized gold constrictions through mechanical perturbation studies, and also showed that peaks in conductance histograms are…
We report first-principles calculations of the inelastic current-voltage (I-V) characteristics of a gold point contact and a molecular junction in the nonresonant regime. Discontinuities in the I-V curves appear in correspondence to the…
For manufacturing Micromegas detectors, the "bulk" method based on photoetching, was successfully developed and widely used in nuclear and particle physics experiments. However, the complexity of the method requires a considerable number of…
For a Higgs boson below the $W^\pm$ threshold, the $\gamma \gamma$ collider option of a future linear $e^+ e^-$ machine is compelling. In this case one can measure the ``gold-plated'' loop induced $\Gamma (H \longrightarrow \gamma \gamma)$…
Silicon is the most popular material used in electronic devices. However, its poor optical properties owing to its indirect band gap nature limit its usage in optoelectronic devices. Here we present the discovery of super-stable…
The Higgs mechanism is essential for the success of the Standard Model (SM) and can be experimentally verified with the determination of the Higgs self-coupling. As the simplest model of a Higgs potential, the SM provides a clear prediction…
Chemical bonding and electronic structure of MgB2, a boron-based newly discovered superconductor, is studied using self-consistent band structure techniques. Analysis of the transformation of the band structure for the hypothetical series…
The current miniaturization of electronic devices raises many questions about the properties of various materials at nanometre-scales. Recent molecular dynamics computer simulations have shown that small finite nanowires of gold exist as…
The escalating demand for ultraviolet (UV) sensing in space exploration, environmental monitoring, and agricultural productivity necessitates detectors that are both environmentally and mechanically resilient. Diamond, featuring its high…
We report on the development of 3D silicon sensors at the University of Science and Technology of China (USTC). The sensor involves columnar electrodes (5 um in diameter) of both doping types, etched from the same wafer side. The p+…
Bond pads are the electrical interconnections of a microelectronic device to the outside world. A polyimide layer (PI) on top of a microelectronic device protects the whole device against environmental impacts. The bond pads are accessible…
Isolated hydrogen and hydrogen pairs in bulk diamond matrix have been studied using density functional theory calculations. The electronic structure and stability of isolated and paired hydrogen defects are investigated at different…